Printed circuits

1. Scope and Applicability

This PCR applies to finished, unpopulated printed circuits supplied as rigid, flexible, or rigid-flex boards or circuits. It covers single-sided, double-sided, and multilayer constructions and additive, semi-additive, subtractive, or mixed conductor-formation routes. The product carries a specified conductive pattern on or within an insulating base and is ready for component assembly after the declared solder mask, legend, surface finish, profiling, inspection, and electrical testing steps.

The PCR covers the manufacture of the unpopulated printed circuit from purchased or internally produced base materials, laminates, copper foils, bonding materials, process chemicals, and other declared inputs through saleable printed circuit output at the manufacturing gate. It does not cover mounting or soldering electronic components, printed circuit board assemblies (PCBAs), semiconductor fabrication, separate electronic components, bare laminates without a formed circuit, waste printed circuits, or downstream equipment assembly and use.

Layer count, rigid or flexible construction, substrate and resin system, halogen and flame-retardant status, board thickness, copper weight and conductor density, hole and interconnect technology, surface finish, solder mask, panel format and utilization, quality class, production geography, manufacturing route, and application class can materially change the inventory. Every conforming foreground data package shall declare these facts rather than treating a narrow board design as representative of all printed circuits.

2. Product Category Identity

Field	Value
canonical_pcr_id	pcr.metal-products-machinery-and-equipment.radio-television-and-communication-equipment-and-apparatus.printed-circuits
classification_refs	CPC 3.0: 47130, exact classification context
covered_products	Finished unpopulated rigid, flexible, and rigid-flex printed circuits; single-sided, double-sided, and multilayer printed circuits; boards made by additive, semi-additive, subtractive, or mixed routes
excluded_products	Populated PCBAs and printed wiring assemblies; mounted electronic components; semiconductors; unprocessed laminates and copper-clad panels without a formed circuit; electronic equipment; waste or scrap printed circuits; treatment services for waste boards
representative_product	One kilogram net mass of saleable, finished, unpopulated printed circuits at the manufacturing gate
production_route	Base-material and panel preparation; lamination when applicable; drilling or other interconnect formation; cleaning and surface preparation; imaging and masking; catalyst and electroless deposition when applicable; electroplating or other conductor build-up; etching and stripping when applicable; solder mask and legend; final surface finishing; profiling, electrical testing, inspection, and packaging
market_state	Finished, tested, unpopulated printed circuit ready for declared component-assembly operations, excluding transport packaging from reference product mass

3. Reference Flow

Field	Value
What	Provide a finished unpopulated printed circuit that carries the declared conductive pattern and is ready for the declared component-assembly process
How much	1 kg net mass of accepted finished printed circuits at the manufacturing gate
How well	Meets the declared drawing, material system, layer stack, conductor and hole specification, surface finish, solder mask, dimensional tolerances, electrical test, acceptance criteria, and quality class
How long or cycle	One declared production lot or reporting period; service life belongs to the downstream assembly or equipment system and is not assumed here
reference_flow_link	The quantitative reference is exactly 1 kg of accepted finished unpopulated printed circuits; rejects, coupons, break-away rails, tooling areas, and transport packaging are excluded from the reference output and recorded separately

Field	Value
Reference amount	1
Reference product flow	Printed circuits b230e7cd-7afd-4398-84bd-71beab1f6626
Reference flow property	Mass 93a60a56-a3c8-11da-a746-0800200b9a66
Reference unit group	Units of mass 93a60a57-a4c8-11da-a746-0800200b9a66
Reference unit	kg
Required qualifiers	rigid, flexible, or rigid-flex construction; substrate and resin system; layer count and stack-up; finished board thickness; copper weight or conductor thickness; panel dimensions and utilization; conductor density or declared design family; through-hole, blind-via, buried-via, microvia, or other interconnect technology; additive, semi-additive, subtractive, or mixed route; solder mask and legend system; surface finish; halogen and flame-retardant declaration; acceptance and quality class; production geography; lot and reporting period; included boundary; net-mass convention

When constructing a foreground data package, the items listed in Required qualifiers shall be declared in dataset metadata, process notes, reference-flow comments, product descriptions, or an equivalent data-package field. Missing required qualifiers make the reference-flow definition incomplete for that data package.

The Tiangong reference product flow is generic to CPC 47130 and uses mass as its quantitative reference. Do not substitute a PCBA or electronic-components flow, a layer-count- or application-specific board flow, or an area-referenced bare-board intermediate for this generic reference flow.

4. Measurement and Unit Rules

rule_id	Applies to	Required property	Required unit	Rule
reference_net_mass	Reference product	Mass 93a60a56-a3c8-11da-a746-0800200b9a66	kg	Report exactly 1 kg of accepted finished unpopulated printed circuits. Exclude transport packaging, rejected boards, test coupons, break-away rails, tooling strips, and recoverable production scrap from reference product mass.
panel_to_product_conversion	Panel-, area-, or item-based production records	Mass and measured area or item count	kg; m2; item(s)	Convert panel, area, and item records to the mass reference using measured accepted-product mass and the actual panel map for the declared product family and lot. Do not use a generic areal density or board mass when a product-specific measurement is available.
material_mass_separation	Base materials and finished product	Mass	kg	Preserve separate dry masses for substrate or laminate, copper and other conductors, bonding materials, solder mask, legend ink, surface-finish metals or coatings, and other intentionally incorporated materials.
chemical_solution_basis	Process chemicals and baths	Mass, volume, and concentration	kg; m3; kg substance/kg solution or equivalent	Record purchased formulation, make-up, replenishment, bail-out, drag-out, bath life, active constituent concentration, and treatment route without treating solution mass as active-substance mass.
water_source_and_reuse	Process water, rinse water, and cooling water	Volume	m3	Separate make-up water by source from internally recirculated water, and separate process-contact water from non-contact cooling or utility water to prevent double counting.
energy_carrier_preservation	Electricity, heat, and fuels	Energy and carrier quantity	kWh; MJ; carrier-specific unit	Preserve carrier, voltage or supply type, heating-value convention, and metered unit. Do not aggregate electricity, supplied heat, and fuels into one undifferentiated energy value.
metal_and_waste_mass_balance	Copper and other metals, rejects, spent baths, sludge, and recovered materials	Mass	kg	Reconcile purchased and opening-stock metal, additions, product incorporation, recoveries, closing stock, wastewater or sludge transfer, and other losses over the same reporting period; disclose unresolved imbalance.

5. System Boundary

The default dataset boundary is cradle-to-gate for saleable unpopulated printed circuits. Upstream material, energy, chemical, water-supply, transport, and treatment burdens are represented by linked datasets; the foreground boundary covers the manufacturing operations and on-site management under the producer's control. A gate-to-gate dataset may be produced only when its starting condition and every omitted upstream stage are explicit.

Boundary Abstraction

Field	Value
declared_starting_condition	Purchased or internally produced copper-clad laminate, flexible substrate, ceramic or other declared insulating base, copper foil, prepreg or bonding material, and process chemicals entering the declared printed-circuit manufacturing system
starting_condition_role	Upstream product inputs to the first foreground panel-preparation or lamination operation
product_classification_scope	Finished unpopulated printed circuits conforming to the semantic boundary of CPC 3.0 code 47130; classification is mapping context and does not define the canonical PCR identity
recursive_input_rule	An input already representing a finished in-scope printed circuit shall be recorded as an upstream product flow and shall not be expanded again inside the receiving foreground process. Intermediate panels made within the same foreground system shall be linked between process stages without duplicating upstream burdens.
upstream_dataset_requirement	Use separately documented datasets for substrates, laminates, copper foil and other metals, resins and bonding materials, process chemicals, electricity, heat, fuels, water supply, packaging, inbound transport, and off-site waste or wastewater treatment; disclose proxy use and data quality.
disclosure	Declare product construction, stack-up, material system, manufacturing route, site and geography, reporting period, panel utilization, yield, internal recycling, wastewater and air-emission controls, off-site treatment, allocation, and the exact terminal boundary.

rule_id	Applies to	Rule	source_ids
boundary_product_scope	Product identity	Include rigid, flexible, and rigid-flex printed circuits and their declared single-, double-, or multilayer routes; exclude component mounting and PCBA operations from the printed-circuit foreground boundary.	us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007
boundary_required_manufacturing	Foreground production	Include applicable base-material preparation, lamination, drilling or other interconnect formation, cleaning, imaging and masking, catalyst and electroless deposition, conductor build-up, electroplating, etching and stripping, solder mask and legend, final surface finish, profiling, testing, inspection, and packaging. Mark non-applicable route steps explicitly.	us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007
boundary_material_energy_water	All foreground stages	Include all purchased and internally transferred materials, process chemicals, bath make-up and replenishment, water by source and use, electricity, heat, fuels, compressed air or other material utilities, and actual internal recycle loops without double counting.	us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007
boundary_waste_emissions	All foreground stages	Include rejects, routing and drilling residues, spent masks and resists, spent baths and etchants, drag-out, rinse wastewater, wastewater-treatment sludge, recovered metals, other hazardous and non-hazardous wastes, and measured or calculated releases to air, water, and soil.	us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007
boundary_cutoff_disclosure	Completeness	Do not omit a known material, chemical, energy, water, transport, waste, or emission flow merely because it lacks a preferred dataset. Record it as unresolved, use a disclosed proxy, or justify its exclusion under the declared study rule.	iso-14044-2006
boundary_downstream_exclusion	Default cradle-to-gate dataset	Exclude component manufacture and mounting, PCBA soldering and cleaning, downstream equipment assembly, distribution of the assembled equipment, use, and end-of-life unless a lifecycle model explicitly adds those stages without double counting.	ifc-electronics-ehs-2007; iso-14044-2006

6. Process Inventory Structure

Process Map

process_id	process_name	inclusion	inclusion_condition	role	quantitative_reference
material_preparation	Base-material preparation and lamination	required	Always; lamination-specific inputs apply only when the declared construction uses lamination	Foreground preparation of the insulating and conductor stack	Prepared panel mass needed for 1 kg accepted finished printed circuits
hole_and_surface_preparation	Drilling, interconnect formation, and surface preparation	required	Always; hole-formation steps are marked not applicable only for a declared route without holes or other formed interconnects	Foreground mechanical and chemical preparation	Prepared board area and mass entering imaging for 1 kg accepted product
conductor_formation	Imaging, masking, plating, etching, and stripping	required	Always; individual additive, semi-additive, subtractive, catalyst, plating, and etching steps follow the declared route	Foreground formation of the conductive pattern	Patterned board output needed for 1 kg accepted product
finishing_and_release	Solder mask, legend, surface finish, profiling, testing, inspection, and packaging	required	Always; the selected surface-finish sequence follows the declared product specification	Foreground completion and release of saleable printed circuits	1 kg accepted finished printed circuits
wastewater_and_waste_management	Process-wastewater, bath, residue, and sludge management	required	Always; model on-site treatment directly and off-site treatment through linked service datasets	Foreground segregation, treatment, recovery, and transfer of manufacturing residuals	Residuals generated while producing 1 kg accepted product

Process: Base-material preparation and lamination (material_preparation)

Inputs

Product flows

Substrates, copper foils, and copper-clad laminates (base_materials)

Record each insulating base, copper foil, copper-clad laminate, flexible film, ceramic base, metal-core base, and other structural material by supplier specification and lot.

• Selected flow: Select material- and supplier-specific Tiangong product flows
• Flow property / unit: Mass / kg; area / m2 retained as supporting activity data
• Amount rule: Purchase-and-stock reconciliation or measured issue to the declared product family, adjusted for returned stock and normalized by accepted output
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_material_bom_and_stock
• Sources: us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes

Prepreg, bonding films, resins, and lamination auxiliaries (lamination_materials)

Record prepreg, adhesive or bonding film, coverlay, resin, release film, separator, and other lamination materials when used.

• Selected flow: Select formulation-specific Tiangong product flows
• Flow property / unit: Mass / kg; area / m2 where purchased by area
• Amount rule: Measured batch issue less documented unused return, allocated to the actual panel map and accepted output
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted finished printed circuits from routes using lamination
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_material_bom_and_stock
• Sources: us-epa-pwb-surface-finishes

Electricity and thermal energy for preparation and lamination (material_preparation_energy)

Record electricity, supplied heat, and fuels for cutting, lay-up, pressing, curing, ventilation, and route-specific preparation.

• Selected flow: Select carrier-, voltage-, technology-, and geography-specific Tiangong product flows
• Flow property / unit: Energy / kWh or MJ; fuel in metered carrier unit
• Amount rule: Sub-metered consumption or documented equipment-load calculation allocated under section 7
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_energy_and_utilities
• Sources: ifc-electronics-ehs-2007

Waste flows

Outputs

Product flows

Prepared or laminated panel (prepared_panel)

Record the dry mass, area, panel count, stack-up, and material composition of prepared panels transferred to the next foreground process.

• Selected flow: Product-specific prepared printed-circuit panel intermediate
• Flow property / unit: Mass / kg; area / m2; number of items / item(s)
• Amount rule: Measured transfer quantity reconciled with material issue, retained stock, trim, and rejects
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: prepared panel needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_batch_route_yield
• Sources: us-epa-pwb-surface-finishes

Waste flows

Offcuts, separator waste, and lamination rejects (preparation_scrap)

Record each residue by material composition and actual recovery, recycling, or disposal route.

• Selected flow: Select material- and treatment-specific Tiangong waste flows
• Flow property / unit: Mass / kg
• Amount rule: Measured segregated waste and rejected-panel mass, reconciled to issued materials and prepared output
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_waste_and_recovery
• Sources: us-epa-pcb-p2-1990

Elementary flows

Lamination and preparation releases to air (preparation_air_releases)

Record measured or permit-calculated releases from cutting, heating, curing, cleaning, and ventilation by substance and compartment.

• Selected flow: Select substance- and compartment-specific Tiangong elementary flows
• Flow property / unit: Mass / kg
• Amount rule: Continuous or periodic measurement, material balance, or documented permit method for the declared reporting period
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_air_emissions
• Sources: us-epa-pcb-p2-1990; ifc-electronics-ehs-2007

Process: Drilling, interconnect formation, and surface preparation (hole_and_surface_preparation)

Inputs

Product flows

Prepared panels entering hole and surface preparation (prepared_panel_input)

Transfer prepared panels without duplicating their upstream burdens.

• Selected flow: Product-specific prepared printed-circuit panel intermediate
• Flow property / unit: Mass / kg; area / m2; number of items / item(s)
• Amount rule: Measured transfer from material_preparation
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: prepared panels needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_batch_route_yield
• Sources: us-epa-pwb-surface-finishes

Drill, routing, desmear, cleaning, and conditioning materials (hole_preparation_materials)

Record drill and routing consumables, abrasives, cleaners, desmear and conditioning chemicals, catalysts, and all bath make-up and replenishment used by the declared interconnect route.

• Selected flow: Select equipment- and formulation-specific Tiangong product flows
• Flow property / unit: Mass / kg; volume / m3; item count for tools
• Amount rule: Measured issue, bath make-up and additions, tool-change records, and purchase-and-stock reconciliation
• Value mode: Calculated value (calculated_value)
• Specificity: Technology-specific (technology_specific)
• Normalization basis: per prepared-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_process_chemicals_and_baths
• Sources: us-epa-pcb-p2-1990; ifc-electronics-ehs-2007

Process and rinse water for hole and surface preparation (hole_preparation_water)

Record make-up water by source and use, separately from recirculated and non-contact water.

• Selected flow: Select source- and geography-specific Tiangong water product flows
• Flow property / unit: Volume / m3
• Amount rule: Metered make-up water or reconciled tank and rinse-line balance
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per prepared-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_water_balance
• Sources: us-epa-pcb-p2-1990; ifc-electronics-ehs-2007

Electricity and utilities for drilling and surface preparation (hole_preparation_energy)

Record electricity and material utilities for drilling, routing, cleaning, pumping, ventilation, and bath temperature control.

• Selected flow: Select carrier-, voltage-, and geography-specific Tiangong product flows
• Flow property / unit: Energy / kWh or MJ; utility in metered unit
• Amount rule: Sub-metered consumption or documented equipment-load calculation allocated under section 7
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per prepared-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_energy_and_utilities
• Sources: ifc-electronics-ehs-2007

Waste flows

Outputs

Product flows

Drilled and conditioned panel (conditioned_panel)

Record the transferred panel mass, area, count, hole technology, and accepted quantity.

• Selected flow: Product-specific drilled and conditioned panel intermediate
• Flow property / unit: Mass / kg; area / m2; number of items / item(s)
• Amount rule: Measured accepted transfer to conductor formation
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: conditioned panels needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_batch_route_yield
• Sources: us-epa-pwb-surface-finishes

Waste flows

Drilling and routing residues and worn tools (mechanical_preparation_waste)

Record collected dust, swarf, backing or entry material, worn tools, filters, and rejected panels by composition and route.

• Selected flow: Select material- and treatment-specific Tiangong waste flows
• Flow property / unit: Mass / kg; item(s) for tools with supporting mass
• Amount rule: Measured waste-container and tool-change records reconciled to production
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per conditioned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_waste_and_recovery
• Sources: us-epa-pcb-p2-1990

Spent preparation baths and contact wastewater (hole_preparation_wastewater)

Record spent bath solution, drag-out, rinses, filter media, and wastewater transferred to recovery or treatment.

• Selected flow: Select composition- and treatment-specific Tiangong waste flows
• Flow property / unit: Volume / m3 and mass / kg of identified constituents
• Amount rule: Metered transfer and bath-disposal records with measured concentration or defensible composition data
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per conditioned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_wastewater_and_effluent
• Sources: us-epa-pcb-p2-1990; ifc-electronics-ehs-2007

Elementary flows

Dust, acid mist, and volatile releases (hole_preparation_air_releases)

Record releases from mechanical preparation, cleaning, and ventilation by substance and compartment after controls.

• Selected flow: Select substance- and compartment-specific Tiangong elementary flows
• Flow property / unit: Mass / kg
• Amount rule: Measured or method-calculated controlled release for the reporting period
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per conditioned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_air_emissions
• Sources: us-epa-pcb-p2-1990; ifc-electronics-ehs-2007

Process: Imaging, masking, plating, etching, and stripping (conductor_formation)

Inputs

Product flows

Conditioned panels entering conductor formation (conditioned_panel_input)

Transfer conditioned panels without duplicating burdens from previous foreground stages.

• Selected flow: Product-specific drilled and conditioned panel intermediate
• Flow property / unit: Mass / kg; area / m2; number of items / item(s)
• Amount rule: Measured transfer from hole_and_surface_preparation
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: conditioned panels needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_batch_route_yield
• Sources: us-epa-pwb-surface-finishes

Imaging, resist, developer, and stripping materials (imaging_materials)

Record films, photoresists, screen inks, developers, stripping agents, cleaners, and related formulation-specific inputs for the actual route.

• Selected flow: Select formulation-specific Tiangong product flows
• Flow property / unit: Mass / kg; volume / m3; area / m2 where supplied as film
• Amount rule: Measured batch issue, bath make-up and replenishment, and purchase-and-stock reconciliation
• Value mode: Calculated value (calculated_value)
• Specificity: Technology-specific (technology_specific)
• Normalization basis: per patterned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_process_chemicals_and_baths
• Sources: us-epa-pcb-p2-1990; ifc-electronics-ehs-2007

Copper, catalysts, plating salts, and etchants (conductor_chemicals)

Record catalyst, electroless and electrolytic copper, other conductor or resist metals, etchants, additives, reducers, complexing agents, acids, alkalis, and every bath make-up, addition, bail-out, and replacement.

• Selected flow: Select substance- and formulation-specific Tiangong product flows
• Flow property / unit: Mass / kg; volume / m3; concentration retained for each formulation
• Amount rule: Purchase-and-stock reconciliation plus bath logs, normalized through measured patterned-panel output
• Value mode: Calculated value (calculated_value)
• Specificity: Technology-specific (technology_specific)
• Normalization basis: per patterned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_process_chemicals_and_baths
• Sources: us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Process and rinse water for conductor formation (conductor_formation_water)

Record make-up water by process line and source, separately from recirculated water.

• Selected flow: Select source- and geography-specific Tiangong water product flows
• Flow property / unit: Volume / m3
• Amount rule: Metered make-up water or reconciled line balance
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per patterned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_water_balance
• Sources: us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Electricity and utilities for conductor formation (conductor_formation_energy)

Record electricity, heat, cooling, ventilation, pumping, compressed air, and other material utilities by line.

• Selected flow: Select carrier-, voltage-, and geography-specific Tiangong product flows
• Flow property / unit: Energy / kWh or MJ; utility in metered unit
• Amount rule: Sub-metered consumption or documented equipment-load calculation allocated under section 7
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per patterned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_energy_and_utilities
• Sources: ifc-electronics-ehs-2007

Waste flows

Outputs

Product flows

Patterned printed-circuit panel (patterned_panel)

Record accepted patterned-panel mass, area, count, route, conductor build, and transfer to finishing.

• Selected flow: Product-specific patterned printed-circuit panel intermediate
• Flow property / unit: Mass / kg; area / m2; number of items / item(s)
• Amount rule: Measured accepted transfer from the declared conductor-formation route
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: patterned panels needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_batch_route_yield
• Sources: us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Waste flows

Spent resists, masks, films, and contaminated solids (imaging_waste)

Record spent films, masks, resists, filters, wipes, containers, and rejected panels by composition and route.

• Selected flow: Select material- and treatment-specific Tiangong waste flows
• Flow property / unit: Mass / kg
• Amount rule: Measured segregated waste and rejected-panel mass
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: per patterned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_waste_and_recovery
• Sources: us-epa-pcb-p2-1990

Spent plating baths, etchants, drag-out, and wastewater (conductor_wastewater)

Record each segregated spent bath, etchant, rinse stream, drag-out recovery stream, and wastewater transfer with metal and relevant constituent concentrations.

• Selected flow: Select composition- and treatment-specific Tiangong waste flows
• Flow property / unit: Volume / m3; mass / kg of identified constituents
• Amount rule: Metered transfer, bath logs, and concentration analyses over the reporting period
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per patterned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_wastewater_and_effluent
• Sources: us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Elementary flows

Controlled releases from imaging, plating, and etching (conductor_air_releases)

Record acid mist, volatile organic compounds, particulates, and other measured or calculated releases after controls.

• Selected flow: Select substance- and compartment-specific Tiangong elementary flows
• Flow property / unit: Mass / kg
• Amount rule: Stack or workplace exhaust measurement, material balance, or documented permit calculation
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per patterned-panel output needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_air_emissions
• Sources: us-epa-pcb-p2-1990; ifc-electronics-ehs-2007

Process: Solder mask, surface finish, testing, and release (finishing_and_release)

Inputs

Product flows

Patterned panels entering finishing (patterned_panel_input)

Transfer patterned panels without duplicating upstream burdens.

• Selected flow: Product-specific patterned printed-circuit panel intermediate
• Flow property / unit: Mass / kg; area / m2; number of items / item(s)
• Amount rule: Measured transfer from conductor_formation
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: patterned panels needed for 1 kg accepted finished printed circuits
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_batch_route_yield
• Sources: us-epa-pwb-surface-finishes

Solder mask, legend, and final surface-finish materials (finishing_materials)

Record solder mask and legend formulations, cleaners, microetch, catalysts, fluxes, solder or alternative coatings, nickel, gold, palladium, silver, tin, organic preservative, and all route-specific bath materials.

• Selected flow: Select formulation- and metal-specific Tiangong product flows
• Flow property / unit: Mass / kg; volume / m3; concentration for each bath or formulation
• Amount rule: Purchase-and-stock reconciliation plus bath make-up, addition, bail-out, and replacement logs
• Value mode: Calculated value (calculated_value)
• Specificity: Technology-specific (technology_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_process_chemicals_and_baths
• Sources: us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Finishing water, electricity, and material utilities (finishing_utilities)

Record make-up water, electricity, heat, cooling, ventilation, compressed air, test energy, and other material utilities for finishing, profiling, testing, and packing.

• Selected flow: Select source-, carrier-, voltage-, technology-, and geography-specific Tiangong product flows
• Flow property / unit: Volume / m3; energy / kWh or MJ; utility in metered unit
• Amount rule: Sub-metered consumption or documented allocation from line and facility records
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_energy_water_finishing
• Sources: us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Transport packaging materials (transport_packaging)

Record bags, desiccants, separators, labels, cartons, trays, reels, pallets, and reusable packaging separately from product mass.

• Selected flow: Select material- and supplier-specific Tiangong product flows
• Flow property / unit: Mass / kg; item(s) with measured mass
• Amount rule: Measured packaging issued to accepted shipment less documented reusable returns
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_product_packaging_and_release

Waste flows

Outputs

Product flows

Accepted finished printed circuits (finished_printed_circuits)

Record accepted net product mass after final profiling, electrical test, dimensional and visual inspection, excluding transport packaging.

• Selected flow: Printed circuits b230e7cd-7afd-4398-84bd-71beab1f6626
• Flow property / unit: Mass 93a60a56-a3c8-11da-a746-0800200b9a66 / kg (Units of mass 93a60a57-a4c8-11da-a746-0800200c9a66)
• Amount rule: exactly 1 kg accepted net product output
• Value mode: Fixed value (fixed_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: PCR reference flow
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Identity reference (identity_reference)

Waste flows

Profiling residues, test rejects, and finishing solids (finishing_scrap)

Record routing residues, test coupons, break-away rails, rejected boards, spent filters, contaminated packaging, and other finishing solids by material and route.

• Selected flow: Select material- and treatment-specific Tiangong waste flows
• Flow property / unit: Mass / kg
• Amount rule: Measured segregated waste and reject mass, reconciled to patterned-panel input and accepted product output
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_waste_and_recovery
• Sources: us-epa-pcb-p2-1990; ifc-electronics-ehs-2007

Spent finishing baths and wastewater (finishing_wastewater)

Record spent surface-finish baths, rinses, drag-out, cleaning solutions, and wastewater transfers by chemistry and destination.

• Selected flow: Select composition- and treatment-specific Tiangong waste flows
• Flow property / unit: Volume / m3; mass / kg of identified constituents
• Amount rule: Metered transfer, bath records, and concentration analyses
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_wastewater_and_effluent
• Sources: us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Elementary flows

Controlled finishing releases to air (finishing_air_releases)

Record releases from mask curing, legend printing, surface-finishing baths, hot-air leveling when used, profiling, and ventilation after controls.

• Selected flow: Select substance- and compartment-specific Tiangong elementary flows
• Flow property / unit: Mass / kg
• Amount rule: Measured or documented method-calculated release over the reporting period
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_air_emissions
• Sources: us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Process: Process-wastewater, bath, residue, and sludge management (wastewater_and_waste_management)

Inputs

Product flows

Treatment chemicals, water, energy, and services (treatment_inputs)

Record treatment reagents, filtration media, water, electricity, fuels, and externally supplied recovery or treatment services for the actual contaminant-specific system.

• Selected flow: Select chemical-, carrier-, and service-specific Tiangong product flows
• Flow property / unit: Mass / kg; volume / m3; energy / kWh or MJ; service-specific unit
• Amount rule: Measured treatment-system records and invoices allocated to the reported manufacturing streams
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: residuals generated while producing 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_wastewater_and_effluent
• Sources: us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Waste flows

Segregated spent baths, wastewater, and residues entering management (residuals_to_treatment)

Record each internal residual transfer once, preserving source process, chemistry, volume, mass, concentration, and hazardous classification.

• Selected flow: Select composition- and treatment-specific Tiangong waste flows
• Flow property / unit: Volume / m3; mass / kg of total stream and identified constituents
• Amount rule: Sum of verified transfers from foreground production stages after removing documented internal returns to process
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: residuals generated while producing 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_wastewater_and_effluent
• Sources: us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Outputs

Product flows

Recovered copper and other materials (recovered_materials)

Record materials that meet the declared recovery output specification, destination, and allocation treatment; do not classify an unverified waste transfer as recovered product.

• Selected flow: Select recovered-material-specific Tiangong product flows
• Flow property / unit: Mass / kg
• Amount rule: Measured accepted recovery output or verified off-site recovery receipt
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_waste_and_recovery
• Sources: us-epa-pcb-p2-1990; ifc-electronics-ehs-2007

Waste flows

Wastewater-treatment sludge and concentrated residues (treatment_sludge)

Record dewatered sludge, filter cake, spent media, concentrated liquids, and other treatment residues by composition and destination.

• Selected flow: Select composition- and treatment-specific Tiangong waste flows
• Flow property / unit: Mass / kg; dry matter and wet mass both retained where relevant
• Amount rule: Measured dispatch mass and moisture or solids content, reconciled with treatment input and effluent
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_waste_and_recovery
• Sources: us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

Elementary flows

Treated effluent released to water (treated_effluent)

Record effluent volume and each reported pollutant after treatment at the actual receiving compartment.

• Selected flow: Select water-quantity and pollutant-specific Tiangong elementary flows for the receiving compartment
• Flow property / unit: Volume / m3 for water; mass / kg for each pollutant
• Amount rule: Discharge flow multiplied by representative measured concentration, with direct load measurements used when available
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted finished printed circuits
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_wastewater_and_effluent
• Sources: us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007

7. Allocation and Co-product Handling

rule_id	Applies to	Rule	source_ids
allocation_avoidance	Multi-product facilities and shared lines	First separate processes, lines, meters, batches, and product-family records so direct inputs, outputs, wastes, and emissions remain assigned to the products that caused them.	iso-14044-2006
allocation_shared_operations	Shared energy, water, ventilation, baths, testing, and utilities	Use measured causal drivers such as sub-metered consumption, equipment operating time, processed panel area, bath loading, number of test cycles, or contaminant load. Mass-only allocation is permitted only when the shared operation is demonstrated to scale with product mass.	iso-14044-2006; us-epa-pwb-surface-finishes
allocation_yield_and_rejects	Production losses and rejected boards	Include the burdens of normal scrap, coupons, rails, test failures, and rework in accepted saleable output. Do not remove the burdens of rejected production from the denominator.	iso-14044-2006
allocation_wastewater_treatment	Combined wastewater and sludge treatment	Allocate by measured stream volume and pollutant load or other treatment-driving characteristics. Do not allocate chemically dissimilar streams by volume alone when contaminant loading materially differs.	us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007
allocation_recovered_materials	Copper and other recovered materials	Prefer subdivision and direct mass accounting. If a recovered material is treated as a co-product or receives a recycling credit, declare the method, point of substitution, quality adjustment, and sensitivity; do not combine allocation and substitution credits for the same recovered amount.	iso-14044-2006
allocation_internal_recycling	Internal bath, rinse, metal, panel, or material loops	Record internal returns explicitly, but count only make-up inputs and net releases across the foreground boundary. Internal circulation shall not create an avoided-burden credit.	us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes

8. Foreground Data Collection, Calculation, and Quality Rules

Data Collection Protocols

protocol_id	process_id	flow_role	record_type	raw_fields	collection_method	unit	frequency	temporal_coverage	site_scope	aggregation_rule	quality_evidence
cp_product_identity_and_output	finishing_and_release	Product identity and accepted output	Specification, route traveller, test record, scale record, release record	product code; drawing revision; construction; stack-up; material system; thickness; copper weight; panel map; interconnect technology; surface finish; solder mask; acceptance class; accepted net mass; packaging mass; lot	Controlled production and release records linked to calibrated weighing	kg; m2; item(s)	Each lot, aggregated monthly	At least 12 representative consecutive months or the full campaign for seasonal or campaign production	Every included site and outsourced operation	Sum accepted net mass by declared product family; retain lot-level qualifiers and exclude packaging	Calibration record; released specification; lot traceability; electrical and dimensional acceptance evidence
cp_material_bom_and_stock	material_preparation	Material inputs	BOM, purchase, stores issue, return, and stock record	material id; supplier; lot; composition; issued quantity; returned quantity; opening and closing stock; panel assignment	Purchase-and-stock reconciliation checked against product BOM and actual panel map	kg; m2; item(s)	Per issue and monthly reconciliation	Same period as accepted output	Every included site	Opening stock + purchases - closing stock - documented returns, assigned to product family and normalized to accepted output	Supplier specification; stock ledger; BOM revision; material lot traceability
cp_batch_route_yield	all production processes	Intermediate transfers, route, and yield	Batch traveller and production execution record	process step; route; panel id; input and output count; input and output mass or area; rework; reject code; transfer time	Lot-level process tracking with reconciliation between consecutive stages	kg; m2; item(s)	Each batch	Same period as accepted output	Every included site and outsourced stage	Sum accepted transfers and losses by route; normalize through accepted output	Route traveller; production-system audit trail; reject disposition
cp_process_chemicals_and_baths	hole_and_surface_preparation; conductor_formation; finishing_and_release	Process chemicals and baths	Purchase, stock, bath make-up, replenishment, analysis, bail-out, and disposal record	formulation; constituent concentration; bath volume; additions; sampling; bail-out; drag-out recovery; replacement; destination	Batch and line logs reconciled to purchase and stock records	kg; m3; concentration-specific unit	Each addition or disposal; monthly reconciliation	Same period as accepted output	Every wet-process line	Opening inventory + purchases + internal returns - closing inventory - disposal - documented losses, assigned to line and product family	Supplier SDS or specification; bath analysis; calibrated dosing record; inventory reconciliation
cp_energy_and_utilities	material_preparation; hole_and_surface_preparation; conductor_formation	Electricity, heat, fuels, and utilities	Meter, fuel, equipment-runtime, and utility invoice record	carrier; meter id; start and end reading; runtime; load; heating value; allocation driver	Sub-metering preferred; otherwise documented equipment calculation reconciled to facility totals	kWh; MJ; carrier-specific unit	Continuous or per shift; monthly reconciliation	Same period as accepted output	Every included site	Sum by carrier and line, subtract unrelated use, allocate under section 7, normalize to accepted output	Meter calibration or invoice; runtime log; reconciliation to site total
cp_water_balance	hole_and_surface_preparation; conductor_formation	Process, rinse, and cooling water	Meter, tank, rinse-line, recycle, and discharge record	source; use; make-up volume; recirculated volume; discharge volume; tank change; concentration where relevant	Source and line sub-metering or reconciled water balance	m3	Continuous or daily; monthly reconciliation	Same period as accepted output	Every included site	Count make-up water once; report recirculation separately; reconcile supply, product retention, evaporation, transfer, and discharge	Meter calibration; water invoice; line log; water-balance closure
cp_energy_water_finishing	finishing_and_release	Finishing water, energy, and utilities	Meter, bath, equipment-runtime, and test-system record	source or carrier; meter; use; runtime; bath or test line; allocation driver	Sub-metered records or documented line calculation	m3; kWh; MJ; utility-specific unit	Continuous or per shift; monthly reconciliation	Same period as accepted output	Every finishing and testing line	Sum by line and allocate under section 7 to accepted output	Meter or invoice; runtime log; line reconciliation
cp_product_packaging_and_release	finishing_and_release	Product release and packaging	Packing list, material issue, shipment, and reusable-return record	packaging material; issued mass and count; returned reusable units; shipment lot; accepted product mass	Measured issue and shipment reconciliation	kg; item(s)	Each shipment; monthly reconciliation	Same period as accepted output	Every dispatch site	Net packaging issued divided by accepted net product mass	Packing specification; scale record; reusable packaging ledger
cp_wastewater_and_effluent	hole_and_surface_preparation; conductor_formation; finishing_and_release; wastewater_and_waste_management	Wastewater, bath transfer, treatment, and effluent	Flow meter, batch disposal, laboratory analysis, treatment log, and discharge record	source line; stream id; volume; pH; constituent concentrations; treatment step; sludge transfer; discharge compartment	Metered flows and representative accredited or qualified laboratory analyses	m3; kg constituent; concentration-specific unit	Continuous flow where available; sample frequency sufficient for permit and process variability	Same period as accepted output	Every included site and receiving treatment system	Calculate loads from matched flow and concentration; preserve segregated streams; reconcile treatment input, effluent, sludge, recovery, and stock	Sampling plan; chain of custody; laboratory QA; meter calibration; treatment reconciliation
cp_waste_and_recovery	all processes	Solid, liquid, hazardous, and recovered residuals	Container weighing, waste manifest, recycler receipt, sludge analysis, and internal transfer record	source; material; hazardous classification; gross and tare mass; moisture or solids; destination; recovery output; certificate	Weighed dispatch and verified destination records	kg; item(s) with supporting mass	Each transfer; monthly reconciliation	Same period as accepted output	Every included site and contractor	Sum net mass by composition and destination; distinguish waste transfer from accepted recovered product	Calibrated scale; manifest; analysis; recycler or treatment receipt
cp_air_emissions	all production processes	Air emissions after controls	Stack test, continuous monitor, material balance, operating hours, and permit calculation	source; substance; flow; concentration; control efficiency; operating hours; method	Measurement preferred; otherwise documented method using foreground activity data	kg substance; concentration-specific unit	Per regulatory and process-representative schedule	Same period as accepted output	Every material emission source	Calculate released mass after controls and allocate by causal operation	Test report; monitor QA; method reference; control operating record

Calculation Rules

rule_id	Applies to	Formula or rule	Inputs	Output	source_ids
calc_reference_output	Accepted product	Sum accepted finished printed-circuit net mass after final test and inspection, excluding packaging, coupons, rails, and rejects.	Lot release and calibrated scale records	kg accepted net product
calc_material_consumption	Each purchased material	Opening stock + purchases + internal receipts - closing stock - documented return; assign by traced batch or the section 7 allocation rule.	Stock, purchase, issue, return, and batch records	kg or m2 material per kg accepted product
calc_chemical_consumption	Each process formulation or constituent	Reconcile opening bath and stock, make-up, additions, internal recovery, bail-out, closing inventory, transfers, and disposal; convert solution to constituent mass using documented concentration.	Bath, dosing, stock, and analysis records	kg formulation and kg constituent per kg accepted product	us-epa-pwb-surface-finishes
calc_makeup_water	Water use	Make-up water supplied from each source; report recirculated water separately and do not add internal recirculation to net withdrawal.	Source meters, line meters, tank and recycle records	m3 make-up water per kg accepted product	ifc-electronics-ehs-2007
calc_energy	Each energy carrier	Sum metered carrier use for included operations, subtract documented unrelated use, and apply the section 7 allocation driver.	Meter, invoice, runtime, and production records	kWh, MJ, or carrier unit per kg accepted product
calc_stage_yield	Each production stage	Accepted output quantity divided by input quantity on a consistent mass, area, or item basis; retain rework and reject disposition.	Batch route, transfer, and reject records	Stage yield and loss by declared route
calc_wastewater_load	Each wastewater constituent	Matched discharge or transfer volume multiplied by representative measured concentration; sum by stream and reporting period before normalization.	Flow and laboratory records	kg constituent per kg accepted product	us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007
calc_material_balance	Product, metals, and treatment system	For each selected balance domain, inputs + opening stock = accepted product + recoveries + waste + releases + closing stock; report absolute and relative unresolved difference.	Material, product, stock, waste, recovery, wastewater, and emission records	Reconciliation and unresolved balance by material	us-epa-pwb-surface-finishes
calc_normalization	All inventory rows	Divide the allocated reporting-period quantity by accepted net product mass from calc_reference_output.	Allocated quantity; accepted net product mass	Inventory quantity per 1 kg accepted finished printed circuits

Data Quality Requirements

requirement_id	Applies to	Requirement	Evidence
dq_product_identity	Product and reference flow	Preserve drawing revision, construction, stack-up, substrate, layer count, conductor and interconnect specification, surface finish, acceptance class, and net-mass convention for every represented product family.	Released specifications, route travellers, BOMs, and lot traceability
dq_technological	Process route	Data shall represent the declared additive, semi-additive, subtractive, or mixed route and the actual hole, plating, etching, mask, finish, test, and control technologies.	Process map, equipment list, bath list, and production records
dq_temporal	Foreground activity data	Use at least 12 representative consecutive months when continuous production exists; for campaign or new production, cover the full campaign and disclose its limitations.	Dated records and coverage statement
dq_geographical	Site and upstream data	Identify every production and outsourced site and match electricity, water, transport, treatment, and material datasets to the represented geography where feasible.	Site list, supplier and contractor records, dataset metadata
dq_measurement	Mass, water, energy, concentration, and emission records	Use calibrated or verified instruments and retain sampling, detection-limit, conversion-factor, and laboratory QA information.	Calibration certificates, sampling plan, laboratory QA, meter reconciliation
dq_completeness	Inventory	Cover all required process stages and all known material, chemical, energy, water, transport, waste, recovery, and emission flows; unresolved items shall be disclosed rather than silently omitted.	Completeness checklist and material, water, and metal balance
dq_allocation	Shared operations	Document the causal allocation driver, coverage, numerator, denominator, and sensitivity for each shared operation or combined treatment system.	Allocation workbook and sensitivity record
dq_upstream_proxies	Linked datasets	Record provider, geography, technology, time, version, representativeness, and proxy rationale for each linked upstream or treatment dataset.	Dataset registry and proxy log
dq_outsourced_operations	Outsourced manufacturing or treatment	Obtain primary activity records or supplier-specific datasets for material outsourced stages; otherwise disclose the proxy and uncertainty.	Supplier data, treatment receipt, audit, or documented proxy

9. Validation Rules

rule_id	Applies to	Rule	source_ids
validate_identity_scope	Product identity	Fail unless the product is an unpopulated printed circuit and the required construction, material, layer, route, finish, quality, geography, period, and boundary qualifiers are declared; reject PCBA, component, laminate-only, equipment, and waste-board substitutions.	ifc-electronics-ehs-2007; us-epa-pwb-surface-finishes
validate_reference_flow	Quantitative reference	Require exactly 1 kg accepted net output using Printed circuits b230e7cd-7afd-4398-84bd-71beab1f6626, Mass 93a60a56-a3c8-11da-a746-0800200b9a66, Units of mass 93a60a57-a4c8-11da-a746-0800200b9a66, and unit kg; packaging and production residues shall be separate.
validate_route_boundary	Process map and boundary	Require every applicable operation in boundary_required_manufacturing, an explicit not-applicable declaration for route steps not used, and separate exclusion of PCBA and downstream equipment stages.	us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007
validate_intermediate_links	Foreground stage transfers	Require prepared, conditioned, and patterned panel transfers to reconcile between adjacent foreground stages without duplicate upstream burdens.
validate_material_and_yield	Material balance and output	Require accepted product mass, stage yields, material inputs, rejects, residues, recoveries, and unresolved mass-balance difference on one reporting period and declared normalization basis.	us-epa-pwb-surface-finishes
validate_chemicals_and_metals	Wet-process inventory	Require formulation, concentration, bath make-up, additions, bail-out or disposal, metal incorporation, recovery, and treatment records for every applicable imaging, plating, etching, and finishing line.	us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes
validate_water_and_wastewater	Water and effluent	Require source-separated make-up water, internal recirculation disclosure, contact and non-contact separation, wastewater volume, relevant constituent loads, treatment route, effluent, and sludge reconciliation.	us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007
validate_energy	Energy and utilities	Require carrier-separated electricity, heat, fuel, and material utility records and a documented allocation driver for shared systems.	ifc-electronics-ehs-2007
validate_waste_recovery_emissions	Residuals and releases	Require wastes by composition and destination, verified recovered outputs, sludge and spent-bath records, and substance- and compartment-specific air, water, and soil releases where applicable.	us-epa-pcb-p2-1990; us-epa-pwb-surface-finishes; ifc-electronics-ehs-2007
validate_allocation	Multi-product and shared operations	Require allocation avoidance where feasible, a causal driver for every shared operation, inclusion of normal reject burdens in accepted output, and no simultaneous allocation and substitution credit for the same recovered amount.	iso-14044-2006
validate_data_quality	Dataset package	Require protocol coverage, temporal and site coverage, calibration and laboratory evidence, upstream dataset and proxy disclosure, allocation documentation, and a list of unresolved completeness items.	iso-14044-2006

10. Published Dataset Profile

Field	Value
dataset_role	Product-specific foreground printed-circuit manufacturing dataset normalized to 1 kg accepted net unpopulated printed circuits
downstream_use	secondary_dataset; background_dataset; input to downstream process or lifecyclemodel records for PCB assembly, electronic components, equipment, or other products
allowed_use	Product footprint, LCA, supply-chain inventory, ecodesign, procurement, and hotspot analysis when construction, route, geography, time, quality, and boundary match the intended use
excluded_use	Generic representation of PCBAs, mounted components, semiconductor manufacture, all printed circuits regardless of construction or route, waste treatment, or comparative assertions when reference-flow qualifiers, boundaries, and data quality are not equivalent
required_metadata	Canonical PCR id and version; product drawing family; rigid, flexible, or rigid-flex construction; substrate and resin system; stack-up and layer count; thickness; copper weight and conductor density; interconnect technology; surface finish; solder mask; halogen and flame-retardant declaration; acceptance class; site and geography; reporting period; panel utilization and yield; route; included processes; allocation; linked datasets; net-mass convention
required_quality_disclosure	Primary-data share; temporal and site coverage; calibration and laboratory QA; stage yield and material-balance closure; water and wastewater reconciliation; chemical and bath coverage; air-emission method; waste and recovery destinations; allocation drivers; outsourced-stage coverage; proxy and missing-flow list; uncertainty limitations
update_trigger	Material change in construction, substrate, stack-up, layer count, conductor density, via technology, additive or subtractive route, plating or etching chemistry, surface finish, solder mask, site, electricity or water supply, wastewater or air controls, panel utilization, yield, allocation, supplier dataset, or reporting period; or correction of a referenced Tiangong identity

11. Data Sources

Source id	Type	Reference	Used for
us-epa-pcb-p2-1990	Official guidance (official_guidance)	U.S. Environmental Protection Agency, Guides to Pollution Prevention: The Printed Circuit Board Manufacturing Industry, EPA/625/7-90/007, June 1990, https://archive.epa.gov/sectors/web/pdf/01050.pdf (retrieved 2026-08-09)	Printed-circuit process decomposition; raw materials; cleaning, surface preparation, electroless plating, imaging, electroplating and etching; waste, bath, rinse, air-emission, and recovery inventory coverage
us-epa-pwb-surface-finishes	Official guidance (official_guidance)	U.S. Environmental Protection Agency Design for the Environment, Printed Wiring Board Surface Finishes: Cleaner Technologies Substitutes Assessment, Volume 1, https://www.epa.gov/sites/default/files/2013-12/documents/pwb_surface_finishes_ctsa_vol1_0.pdf (retrieved 2026-08-09)	Rigid, flexible and rigid-flex scope; layer types; multilayer production sequence; surface-finish alternatives; process material balance; water, wastewater, spent bath, sludge, solid-waste, and recovery accounting
ifc-electronics-ehs-2007	Official guidance (official_guidance)	International Finance Corporation / World Bank Group, Environmental, Health, and Safety Guidelines for Semiconductors & Other Electronics Manufacturing, 30 April 2007, https://www.ifc.org/content/dam/ifc/doc/2000/2007-semiconductors-electronic-ehs-guidelines-en.pdf (retrieved 2026-08-09)	PCB and PCBA boundary distinction; additive, semi-additive and subtractive routes; board preparation, imaging, plating, finishing and testing; hazardous materials, wastes, air emissions, energy, wastewater segregation, treatment, and recovery
iso-14044-2006	Standard (standard)	ISO 14044:2006, Environmental management — Life cycle assessment — Requirements and guidelines, including published amendments, https://www.iso.org/standard/38498.html (retrieved 2026-08-09)	Goal and scope, life-cycle inventory, allocation, reporting, review, completeness, and data-quality framework