Electronic integrated circuits

1. Scope and Applicability

This PCR applies to electronic integrated circuits delivered as saleable, electrically tested devices at the declared manufacturing gate. It covers general integrated-circuit families, including logic and micro devices, memory devices, analog devices, and mixed-signal devices assigned by their dominant function. A conforming dataset shall describe a representative product family and production mix; it shall not use one chip design, one wafer, or one narrowly specified device as an undeclared proxy for the full category.

The foreground boundary covers wafer fabrication from a declared incoming semiconductor substrate or wafer, wafer sort and dicing, assembly and packaging, final electrical test, and preparation of accepted product for delivery. Purchased substrate production, chemicals, gases, electricity, water, packaging materials, and waste-treatment services are represented by traceable upstream datasets unless they are collected as foreground operations. Product design, software, fabrication equipment manufacture, use in downstream equipment, distribution after the manufacturing gate, and end-of-life are outside the default foreground boundary and shall be disclosed if included.

Discrete semiconductor devices, photovoltaic cells, LEDs, bare semiconductor wafers without integrated circuitry, printed circuit boards, smart-card bodies, connector or leadframe parts sold separately, and complete electronic equipment are excluded. A bare die is in scope only when it is the electrically tested saleable delivery state and that state is explicitly declared; an untested wafer or intermediate die shall not stand in for a finished integrated circuit.

2. Product Category Identity

Field	Value
canonical_pcr_id	pcr.metal-products-machinery-and-equipment.radio-television-and-communication-equipment-and-apparatus.electronic-integrated-circuits
classification_refs	CPC 3.0: 47160 Electronic integrated circuits (exact classification context; no accepted mapping edge is asserted by this PCR)
covered_products	Saleable electronic integrated circuits in logic and micro, memory, analog, and mixed-signal families; packaged monolithic, multi-die, chiplet, and wafer-level-package devices; electrically tested bare die only when declared as the finished delivery state
excluded_products	Unprocessed or processed wafers sold without a finished IC function; untested intermediate die; discrete diodes, transistors, sensors, LEDs and photovoltaic devices; separately sold leadframes, substrates, connectors and smart-card modules; printed circuit boards and complete equipment
representative_product	A declared production-weighted mix of accepted electronic integrated circuits within one stated family, technology-node range, substrate material, wafer diameter, die construction, package route, delivery state, geography, and reporting period
production_route	Semiconductor substrate or wafer supply; repeated deposition, lithography, etch, doping, cleaning, planarization and metallization; wafer sort and dicing; assembly and packaging; final electrical test; shipment preparation at the manufacturing gate
market_state	Saleable, electrically tested integrated circuit at the manufacturer gate; package form or tested bare-die delivery state explicitly declared

3. Reference Flow

Field	Value
What	Electronic integrated circuits meeting the declared identity, electrical acceptance criteria, and delivery-state specification
How much	1 kg net mass of accepted finished integrated circuits
How well	Accepted by the declared final electrical test and outgoing quality criteria; family and dominant function, technology node, substrate, die area and count, package or bare-die form, and geography are declared
How long or cycle	One stated reporting period, normally 12 consecutive months or a justified production campaign covering representative wafer fabrication, assembly and test
reference_flow_link	Tiangong Product flow bc98e461-2434-4229-8788-7ffb5c4b9a2e

Field	Value
Reference amount	1
Reference product flow	Electronic integrated circuit, unspecified bc98e461-2434-4229-8788-7ffb5c4b9a2e
Reference flow property	Mass 93a60a56-a3c8-11da-a746-0800200b9a66
Reference unit group	Units of mass 93a60a57-a4c8-11da-a746-0800200c9a66
Reference unit	kg
Required qualifiers	IC family and dominant function (logic/micro, memory, analog, or mixed-signal); marketed device function and application class; technology node or process generation; semiconductor substrate material; wafer diameter; total active die area per delivered device; monolithic, multi-die or chiplet construction and die count; package type or tested bare-die delivery state; final-test acceptance criterion; fab, assembly and test geography; reporting period; electricity supply mix; fluorinated-gas and N2O abatement configuration

When constructing a foreground data package, the items listed in Required qualifiers must be declared in dataset metadata, process notes, reference flow comment, product description, or an equivalent data package field. Missing required qualifiers make the reference flow definition incomplete for that data package.

4. Measurement and Unit Rules

rule_id	Applies to	Required property	Required unit	Rule
reference_mass	accepted reference product	Mass 93a60a56-a3c8-11da-a746-0800200b9a66	kg	Measure net mass of accepted delivered ICs. Include die, encapsulant, package substrate or leadframe, interconnects, terminals, lids and integrated heat spreaders that are part of the delivered device; record transport packaging separately.
count_to_mass	unit-count production records	Mass 93a60a56-a3c8-11da-a746-0800200b9a66	kg	Convert accepted device count to mass using lot- or product-family-specific measured net mass per accepted device. Do not use a single catalogue device mass for a multi-product production mix.
wafer_area_traceability	wafer fabrication and die yield	Area and Mass	m2 and kg	Retain wafer diameter, processed wafer area, gross die count, known-good die count, die area and sequential yields. Convert wafer-level records to the reference mass only through the traced accepted-output calculation.
family_parameterization	all foreground records	Not applicable	declared metadata	Stratify records at least by IC family or dominant function, technology node or process generation, substrate material, wafer diameter, die area, die count, package route and delivery state; aggregate only with production weights for the declared reporting period.
energy_conversion	electricity and fuels	Energy	kWh or MJ	Preserve the invoiced or metered unit. If conversion is required, use 1 kWh = 3.6 MJ, retain the original record, and avoid mixing electricity with thermal fuel energy.
gas_and_liquid_conversion	process gases, chemicals, water and wastewater	Mass or Volume	kg or m3	Preserve measured mass or volume and physical state; where conversion is necessary, use batch-specific density and conditions and retain the original quantity and conversion basis.
direct_emission_speciation	fab and test direct emissions	Mass	kg per emitted substance	Record each fluorinated GHG, N2O, regulated hazardous air pollutant and fugitive heat-transfer fluid as a separate elementary flow. Do not report purchased gas as emitted gas without measured or method-based utilization, by-product and abatement treatment.

5. System Boundary

The dataset is cradle-to-manufacturing-gate for the declared IC production mix. Foreground records shall include cleanroom and production-tool utilities, process materials and gases, yield losses, internal material transfers, direct emissions, wastewater, wastes, and on-site abatement or treatment. Upstream datasets shall cover every purchased product or service that crosses the boundary. Shipping from the manufacturing gate, downstream board assembly, device use, and end-of-life are excluded unless a wider study scope is explicitly declared.

Boundary Abstraction

Field	Value
declared_starting_condition	Incoming semiconductor substrate or wafer and all purchased materials, utilities and services at the first foreground manufacturing gate, with supplier identity, physical state, production geography and upstream dataset reference declared
starting_condition_role	Traceable upstream input to wafer fabrication; substrate or wafer production may be foreground only when the reporting organization operates and measures that stage
product_classification_scope	Electronic integrated circuits across logic/micro, memory, analog and mixed-signal families; the concrete dataset is restricted to its declared family, process generation and delivery-state mix
recursive_input_rule	An internally transferred fabricated wafer, known-good die or packaged IC is recorded once as an intermediate product flow between foreground processes and carries no duplicated upstream burden. A purchased IC of the same category is an upstream product dataset and shall not be treated as self-produced reference output.
upstream_dataset_requirement	Require geographically and technologically appropriate datasets for semiconductor substrates or wafers, electricity, fuels, ultrapure-water supply, chemicals, bulk and specialty gases, packaging materials, transport to the first foreground gate, and external waste or wastewater treatment
disclosure	Declare included sites and operations; IC-family shares; process nodes; substrate and wafer diameter; package and tested-bare-die shares; yields; cut-offs; upstream dataset versions; allocation drivers; electricity mixes; abatement technologies, uptime and destruction or removal evidence; and any departure from this boundary

Normative Boundary Rules

rule_id	applies_to	rule	source_ids
boundary_complete_route	foreground_process_chain	Include wafer fabrication, wafer sort and dicing, assembly and packaging, final electrical test, yield losses, direct emissions, and preparation of accepted product for delivery for every route represented in the reference product.	us-epa-semiconductor-neshap; epd-international-pcr-2024-06
boundary_upstream_inputs	purchased_inputs	Link every purchased substrate, wafer, chemical, gas, utility, packaging material and treatment service to an upstream dataset or a documented foreground operation; do not omit a major input because no generic IC quantity is available.	iso-14044-2006; iec-63366-2025
boundary_family_strata	category_mix	Keep logic/micro, memory, analog and mixed-signal strata and materially different node, substrate, die-area, package and geography routes separate until production-weighted aggregation.	wsts-product-classification-2021; proske-et-al-2024-die-area
boundary_no_proxy	representativeness	Do not use one device, one wafer, one package technology, one application, or one manufacturing route as an undeclared proxy for this broad category.	wsts-product-classification-2021; proske-et-al-2024-die-area
boundary_direct_gases	wafer_fabrication_and_test	Include fluorinated process gases, fluorinated heat-transfer fluids, N2O, their by-products, and abatement-system operation and downtime whenever applicable; preserve substance-level emissions.	us-epa-semiconductor-industry; us-epa-ghgrp-subpart-i
boundary_excluded_stages	downstream_and_capital	Exclude downstream board assembly, product use, distribution after the manufacturing gate and end-of-life from this dataset. Disclose and justify treatment of design, R&D, buildings and capital equipment, and include them only under an explicitly extended scope.	epd-international-pcr-2024-06; iec-63366-2025

6. Process Inventory Structure

Process Map

process_id	process_name	inclusion	inclusion_condition	role	quantitative_reference
wafer_fabrication	Wafer fabrication	required	Always included for integrated circuitry represented by the reference product; purchased finished die may be represented only as a traced upstream dataset for an assembly-only reporting organization	Foreground circuit formation and wafer processing	Processed wafer area and known-good-die output normalized to accepted reference-product mass
wafer_sort_dicing	Wafer sort and dicing	required	Always included or represented by a supplier dataset when tested die are purchased	Foreground wafer electrical sort, singulation and die acceptance	Known-good die mass and area transferred to assembly per accepted reference-product mass
assembly_packaging	Assembly and packaging	required	Included for packaged devices; for tested bare-die delivery, record an explicit not-applicable package route while retaining handling and final-test operations	Foreground die attach or bonding, interconnection, encapsulation or wafer-level packaging	Packaged-device output before final acceptance per accepted reference-product mass
final_test_delivery	Final test and delivery preparation	required	Always included for the saleable delivery state	Foreground burn-in when applicable, final electrical test, marking, accepted-output measurement and shipment preparation	1 kg accepted electronic integrated circuits

Process: Wafer fabrication (wafer_fabrication)

Inputs

Product flows

Semiconductor substrate or incoming wafer (fab_substrate)

Record the substrate or wafer entering circuit fabrication, including material, diameter, thickness, supplier geography and upstream production dataset.

• Selected flow: Semiconductor substrate or wafer, specified by material and delivery state
• Flow property / unit: Mass / kg and area / m2
• Amount rule: measured received and issued mass and processed area attributable to the declared production strata
• Value mode: Foreground record (foreground_record)
• Specificity: Technology-specific (technology_specific)
• Normalization basis: per 1 kg accepted reference product through traced sequential yield
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_fab_materials
• Sources:

Wafer-fabrication electricity (fab_electricity)

Record metered electricity for cleanroom systems and process tools serving deposition, lithography, etch, implant or diffusion, cleaning, planarization, metallization and supporting fab operations.

• Selected flow: Electricity supply, specified by voltage level and geographic market
• Flow property / unit: Energy / kWh
• Amount rule: metered fab electricity allocated to the declared production strata using documented causal drivers
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_fab_utilities
• Sources:

Ultrapure and process water (fab_water)

Record make-up water entering ultrapure-water generation and other wafer-fabrication uses separately from recirculated water; retain withdrawal and discharge records.

• Selected flow: Water supply, specified by source and treatment state
• Flow property / unit: Mass / kg
• Amount rule: measured make-up water attributable to the declared wafer-fabrication strata
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_fab_utilities
• Sources:

Process chemicals and patterning materials (fab_process_chemicals)

Record acids, bases, solvents, photoresists, developers, dopant sources, deposition precursors, cleaning agents, electroplating chemicals and planarization slurries by substance or purchased mixture.

• Selected flow: Each purchased process chemical or formulated material as a separate product flow
• Flow property / unit: Mass / kg
• Amount rule: inventory issue, purchase reconciliation or tool-delivery records attributable to the declared production strata
• Value mode: Foreground record (foreground_record)
• Specificity: Technology-specific (technology_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_fab_materials
• Sources: us-epa-semiconductor-neshap

Bulk, specialty and fluorinated process gases (fab_process_gases)

Record each gas separately, including bulk gases, deposition and doping gases, fluorinated etch or chamber-clean gases, and N2O; retain cylinder, bulk-delivery, point-of-use and abatement routing records.

• Selected flow: Each purchased process gas as a separate product flow
• Flow property / unit: Mass / kg
• Amount rule: measured or reconciled gas consumption by gas and process type for the declared production strata
• Value mode: Foreground record (foreground_record)
• Specificity: Technology-specific (technology_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_fab_gases_emissions
• Sources: us-epa-semiconductor-industry; us-epa-ghgrp-subpart-i

Outputs

Product flows

Fabricated wafer transferred to sort (fabricated_wafer)

Record wafer output after completion of the declared front-end and interconnect sequence, preserving wafer count, processed area, gross die count and route identity.

• Selected flow: Fabricated semiconductor wafer with integrated circuits, internal intermediate
• Flow property / unit: Mass / kg and area / m2
• Amount rule: calculated from completed-wafer records and traced to accepted output through sequential yield
• Value mode: Calculated value (calculated_value)
• Specificity: Technology-specific (technology_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_fab_output_yield
• Sources: proske-et-al-2024-die-area

Waste flows

Wafer-fabrication wastes and wastewater (fab_wastes)

Record spent process baths, solvent and resist wastes, slurry, contaminated solids, off-spec wafers, wastewater and treatment residues by waste identity and destination.

• Selected flow: Each wafer-fabrication waste or wastewater stream as a separate waste flow
• Flow property / unit: Mass / kg
• Amount rule: measured waste shipment, treatment-system and wastewater records attributable to the declared production strata
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_fab_waste
• Sources:

Elementary flows

Direct fab air emissions (fab_direct_air_emissions)

Record emitted fluorinated GHGs, N2O, fluorinated heat-transfer fluids and regulated hazardous air pollutants separately after applicable utilization, by-product formation and abatement.

• Selected flow: Each emitted substance as its corresponding elementary flow
• Flow property / unit: Mass / kg
• Amount rule: stack measurement or a documented substance- and process-specific calculation using measured gas input, utilization, by-product formation, abatement efficiency and downtime
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_fab_gases_emissions
• Sources: us-epa-semiconductor-industry; us-epa-ghgrp-subpart-i; us-epa-semiconductor-neshap

Process: Wafer sort and dicing (wafer_sort_dicing)

Inputs

Product flows

Fabricated wafer received for sort (sort_fabricated_wafer_input)

Record the internal fabricated-wafer transfer without duplicating its upstream burden.

• Selected flow: Fabricated semiconductor wafer with integrated circuits, internal intermediate
• Flow property / unit: Mass / kg and area / m2
• Amount rule: equal to the traced fabricated-wafer output received by wafer sort
• Value mode: Calculated value (calculated_value)
• Specificity: Technology-specific (technology_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_sort_yield
• Sources: proske-et-al-2024-die-area

Sort and dicing utilities and consumables (sort_utilities_consumables)

Record electricity, test equipment utilities, dicing water, blades or wire, tapes, carriers and cleaning materials used in wafer sort and singulation.

• Selected flow: Each utility and consumable as a separate product flow
• Flow property / unit: Energy / kWh or Mass / kg
• Amount rule: metered, issued or purchased quantity attributable to the declared sort and dicing strata
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_sort_inputs
• Sources:

Outputs

Product flows

Known-good die transferred to assembly (known_good_die)

Record accepted die count, area and mass by product family and route after wafer sort and dicing.

• Selected flow: Known-good integrated-circuit die, internal intermediate
• Flow property / unit: Mass / kg and area / m2
• Amount rule: calculated from accepted die count, measured or engineering-controlled die area and die mass, and traced sort yield
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_sort_yield
• Sources: proske-et-al-2024-die-area

Waste flows

Sort and dicing rejects and residues (sort_dicing_waste)

Record electrically rejected die, edge and kerf losses, damaged wafers, dicing slurry or wastewater, used tape and other residues by treatment route.

• Selected flow: Each sort or dicing waste stream as a separate waste flow
• Flow property / unit: Mass / kg
• Amount rule: calculated rejected mass reconciled with measured waste and yield records
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_sort_yield
• Sources:

Process: Assembly and packaging (assembly_packaging)

Inputs

Product flows

Known-good die received for assembly (assembly_die_input)

Record the internal known-good-die transfer by die count, total active die area and mass without duplicating wafer-fabrication burdens.

• Selected flow: Known-good integrated-circuit die, internal intermediate
• Flow property / unit: Mass / kg and area / m2
• Amount rule: equal to known-good die issued to the declared package routes, including assembly yield reconciliation
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_assembly_materials_yield
• Sources: proske-et-al-2024-die-area

Package and interconnect materials (assembly_package_materials)

Record package substrates or leadframes, interposers, bonding wire, bumps or solder, die attach, underfill, mold compound, lids, heat spreaders, terminals and other delivered-device materials by package route.

• Selected flow: Each package and interconnect material or component as a separate product flow
• Flow property / unit: Mass / kg
• Amount rule: bill-of-material, issue or purchase records reconciled to assembled and accepted output
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_assembly_materials_yield
• Sources:

Assembly energy, water and process consumables (assembly_utilities)

Record electricity, fuels, water, cleaning agents, plating chemicals, process gases and other utilities used for die attach, bonding, encapsulation, curing, plating and package singulation.

• Selected flow: Each assembly utility or process consumable as a separate product flow
• Flow property / unit: Energy / kWh or Mass / kg
• Amount rule: metered or issued quantity attributable to the declared package routes
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_assembly_utilities
• Sources:

Outputs

Product flows

Packaged IC before final test (packaged_ic_intermediate)

Record assembled device output by package route before final electrical acceptance.

• Selected flow: Packaged electronic integrated circuit, internal intermediate
• Flow property / unit: Mass / kg
• Amount rule: calculated from assembled unit count and measured package-route net mass, reconciled with assembly yield
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_assembly_materials_yield
• Sources:

Waste flows

Assembly rejects and material wastes (assembly_waste)

Record rejected die and packages, excess mold compound, substrate or leadframe trim, plating wastes, spent chemicals, wastewater and other assembly residues by destination.

• Selected flow: Each assembly waste or wastewater stream as a separate waste flow
• Flow property / unit: Mass / kg
• Amount rule: measured waste and reject records reconciled with material input and assembly yield
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_assembly_materials_yield
• Sources:

Process: Final test and delivery preparation (final_test_delivery)

Inputs

Product flows

Packaged IC or tested-bare-die lot entering final acceptance (test_device_input)

Record the internal device transfer into burn-in and final electrical test; for bare-die delivery, identify the tested-die route explicitly.

• Selected flow: Packaged IC or known-good die, internal intermediate according to declared delivery state
• Flow property / unit: Mass / kg
• Amount rule: measured input mass and unit count reconciled with final-test acceptance
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_final_test_output
• Sources:

Final-test electricity and heat-transfer utilities (test_utilities)

Record electricity for test and burn-in and any fuels, cooling media or fluorinated heat-transfer fluids used during temperature control and test.

• Selected flow: Each final-test energy carrier and heat-transfer fluid as a separate product flow
• Flow property / unit: Energy / kWh or Mass / kg
• Amount rule: metered or issued quantity attributable to the declared test routes and accepted production
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_test_utilities_emissions
• Sources: us-epa-ghgrp-subpart-i

Delivery packaging (delivery_packaging)

Record trays, reels, tubes, carriers, moisture-barrier bags, desiccants, labels and cartons supplied with accepted devices; keep their mass outside the reference-product net mass.

• Selected flow: Each delivery-packaging material or component as a separate product flow
• Flow property / unit: Mass / kg
• Amount rule: bill-of-material or issue records attributable to accepted product deliveries
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_delivery_packaging
• Sources:

Outputs

Product flows

Accepted electronic integrated circuits (accepted_integrated_circuit)

Record only devices meeting the declared final electrical and outgoing quality criteria as reference-product output.

• Selected flow: Electronic integrated circuit, unspecified bc98e461-2434-4229-8788-7ffb5c4b9a2e
• Flow property / unit: Mass 93a60a56-a3c8-11da-a746-0800200b9a66 / kg
• Amount rule: exactly 1 kg net mass of accepted finished product after final-test reject reconciliation
• Value mode: Fixed value (fixed_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Identity reference (identity_reference)
• Sources:

Waste flows

Final-test rejects and delivery-preparation waste (test_delivery_waste)

Record failed devices, burn-in rejects, damaged carriers, packaging scrap and other final-stage wastes by destination.

• Selected flow: Each final-test reject or delivery-preparation waste stream as a separate waste flow
• Flow property / unit: Mass / kg
• Amount rule: measured reject and waste mass reconciled with input and accepted output
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_final_test_output
• Sources:

Elementary flows

Fugitive final-test heat-transfer-fluid emissions (test_htf_emissions)

When fluorinated heat-transfer fluids are used, record substance-specific fugitive emissions from inventory change, purchases, recovery and disposition records.

• Selected flow: Each emitted heat-transfer-fluid substance as its corresponding elementary flow
• Flow property / unit: Mass / kg
• Amount rule: calculated substance-specific fugitive loss from collected inventory and disposition records
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: per 1 kg accepted reference product
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_test_utilities_emissions
• Sources: us-epa-ghgrp-subpart-i

7. Allocation and Co-product Handling

rule_id	applies_to	rule	source_ids
allocation_subdivide_first	shared_manufacturing	First subdivide records by site, reporting period, IC family or dominant function, technology node or process generation, substrate and wafer diameter, die-area class, package route and delivery state whenever separately measured.	iso-14044-2006; proske-et-al-2024-die-area
allocation_wafer_fab_driver	shared_wafer_fabrication	Allocate shared wafer-fabrication inputs and emissions using a documented causal engineering driver such as processed wafer area combined with route-specific process steps, mask layers, tool time or measured chamber consumption. Do not allocate a broad fab mix from one wafer or one device.	iso-14044-2006; proske-et-al-2024-die-area
allocation_assembly_test_driver	shared_assembly_and_test	Allocate package, assembly and test burdens using route-specific measured material issue, equipment time, test time, energy or another demonstrated causal driver; accepted-unit count is allowed only for materially equivalent routes.	iso-14044-2006
allocation_yield_losses	sequential_yield	Assign substrate, materials, utilities, direct emissions and treatment burdens of rejected wafers, die and packages to the accepted outputs of the same production stratum through sequential yield reconciliation.	iso-14044-2006; proske-et-al-2024-die-area
allocation_category_aggregation	reference_product_mix	Aggregate strata only with accepted-output mass for the declared reporting period after each stratum is normalized. Report family shares and do not infer unrepresented families from a narrow product dataset.	wsts-product-classification-2021; proske-et-al-2024-die-area
allocation_recovery	recovered_materials_and_energy	Report recovered materials, exported energy and external recycling consistently with the declared LCA method; disclose the substitution or cut-off convention and prevent double counting between avoided burdens, waste treatment and co-product credit.	iso-14044-2006; iec-63366-2025

8. Foreground Data Collection, Calculation, and Quality Rules

Data Collection Protocols

protocol_id	process_id	flow_role	record_type	raw_fields	collection_method	unit	frequency	temporal_coverage	site_scope	aggregation_rule	quality_evidence
cp_fab_materials	wafer_fabrication	substrate, chemicals and patterning materials	purchase, warehouse issue, recipe and tool-delivery records	material identity; supplier; lot; mass or volume; density and conditions; wafer material, diameter and count; process stratum	reconcile purchases, stock change, issues and returned material; preserve substance or mixture identity	kg, m3, m2, item	monthly and lot-level	full reporting period with opening and closing stock	every included fab	sum by material and production stratum, then normalize through sequential yield	purchase records, calibrated delivery systems, inventory reconciliation and recipe revision history
cp_fab_utilities	wafer_fabrication	electricity, fuels and water	utility meter and facility balance records	meter id; interval; electricity; fuel; make-up water; recirculated water; discharge; allocation driver	use submetered tool or area data where available; otherwise reconcile facility totals to documented cleanroom and process drivers	kWh, MJ, kg, m3	at least monthly	full reporting period	every included fab and utility system	sum by utility and production stratum; do not net recirculated water against withdrawal without disclosure	meter calibration, invoices, facility balance and coverage log
cp_fab_gases_emissions	wafer_fabrication	process-gas input, by-products, direct emissions and abatement	gas delivery, point-of-use, recipe, stack test, abatement and downtime records	gas identity; input mass; process type; utilization; by-products; abatement connection; DRE; uptime; stack measurement; emission method	measure by substance where available; otherwise apply a documented regulatory or facility engineering model to measured inputs	kg per substance	batch or monthly; abatement downtime event-level	full reporting period	every included fab, process type and abatement system	calculate each gas and by-product separately and sum after abatement; retain controlled and uncontrolled periods	calibrated mass-flow or purchase reconciliation, stack-test report, abatement maintenance and downtime log
cp_fab_output_yield	wafer_fabrication	fabricated-wafer output and front-end yield	manufacturing execution and wafer genealogy records	wafer id; diameter; processed area; route; node; gross die count; completed wafer count; scrap; transfer destination	preserve wafer genealogy and link completed wafers to downstream accepted die and product	wafer, m2, kg, item	per wafer lot	full reporting period	every included fab and production stratum	calculate processed area and traced output per stratum before reference-flow normalization	MES extract, lot traveler, route revision and yield reconciliation
cp_fab_waste	wafer_fabrication	wastewater, spent chemicals, solids and off-spec wafers	waste manifests, treatment meters and laboratory records	waste identity; hazardous status; mass or volume; concentration where relevant; destination; treatment; recovery	reconcile on-site treatment inputs and outputs with external shipments and wastewater discharge	kg, m3	monthly and shipment-level	full reporting period	every included fab and treatment system	sum separately by waste identity and destination; no netting against recovered output without allocation disclosure	manifests, scale tickets, discharge meters, laboratory analyses and treatment logs
cp_sort_inputs	wafer_sort_dicing	sort and dicing utilities and consumables	meters, purchase and issue records	electricity; water; blade or wire; tape; carrier; cleaning material; lot and route	reconcile meter and issued quantities to processed wafer lots	kWh, kg, item	lot-level or monthly	full reporting period	every included sort and dicing site	sum by route and normalize through accepted-die yield	meter records, issue logs, lot travelers and stock reconciliation
cp_sort_yield	wafer_sort_dicing	fabricated-wafer input, known-good die and rejects	wafer map, probe, dicing and die genealogy records	wafer id; gross dies; tested dies; known-good dies; die area; accepted die mass; reject class; kerf and residues	link wafer maps and singulation results to die transferred to assembly	item, mm2, kg	per wafer lot	full reporting period	every included sort and dicing site	calculate known-good die output and rejected mass by stratum; reconcile with fabricated-wafer input	wafer map, probe result, calibrated dimensional data and reject disposition
cp_assembly_materials_yield	assembly_packaging	die input, package materials, output and rejects	bill-of-material, issue, genealogy, equipment and reject records	die count and area; package route; each material mass; assembled units; accepted units; reject mass and cause	reconcile material issues and die genealogy to packaged output by route	kg, item, mm2	per assembly lot	full reporting period	every included assembly site and route	calculate package-route material input, output and reject balance before reference-flow normalization	approved BOM, lot genealogy, scale records, MES yield and reject disposition
cp_assembly_utilities	assembly_packaging	assembly energy, water and consumables	meters, recipes, purchase and issue records	electricity; fuel; water; process gas; chemical; equipment time; package route	use submeters where available and document causal allocation where utilities are shared	kWh, MJ, kg, m3, h	lot-level or monthly	full reporting period	every included assembly site	sum by route and allocate with measured equipment time or other causal driver	meter calibration, invoices, recipe history and allocation workbook
cp_final_test_output	final_test_delivery	test input, accepted reference product and rejects	test-handler, burn-in, outgoing quality and mass records	input units; test route and duration; accepted units; reject class; measured net unit mass; delivery state; family qualifiers	reconcile test input to accepted and rejected output; determine net accepted mass by representative measurement	item, h, kg	per final-test lot	full reporting period	every included final-test site	sum accepted net product mass by stratum; normalize all strata to exactly 1 kg accepted output	test logs, calibration, sampling plan, outgoing release and mass reconciliation
cp_test_utilities_emissions	final_test_delivery	test electricity, cooling and heat-transfer-fluid emissions	meters, HTF inventory, purchase, recovery and disposition records	electricity; fuel; cooling; HTF identity; opening and closing stock; purchases; recovery; disposal; leaks	meter energy and calculate substance-specific HTF loss from complete inventory balance	kWh, MJ, kg	monthly and leak-event-level	full reporting period	every included final-test site	sum by test route; report each emitted HTF separately	meters, inventory ledger, maintenance, leak and disposal records
cp_delivery_packaging	final_test_delivery	delivery packaging	packaging BOM, issue and shipment records	material; component; mass; units per tray, reel or carton; accepted product mass	reconcile packaging issue to accepted shipments; exclude packaging from reference-product net mass	kg, item	shipment or monthly	full reporting period	every included delivery site	sum by material and normalize to accepted product mass	approved packaging specification, issue and shipment records

Calculation Rules

rule_id	Applies to	Formula or rule	Inputs	Output	source_ids
calc_reference_normalization	all inventory rows	normalized amount = stratum amount / accepted net reference-product mass for the same stratum; production-mix result = sum of normalized stratum amounts weighted by accepted stratum mass share	collected stratum amount; accepted net product mass; mass share	amount per 1 kg accepted IC	iso-14044-2006
calc_count_to_mass	accepted and intermediate device counts	mass = accepted or transferred device count multiplied by the measured representative net mass per device for the same product and delivery-state stratum	device count; sampling result for net unit mass	kg of devices
calc_sequential_yield	wafer, die, assembly and test genealogy	retain front-end completion, sort, assembly and final-test yields separately; input required per accepted output is calculated from actual genealogy and shall not be replaced by one overall generic yield	wafer starts; completed wafers; gross and known-good dies; assembled and tested units; accepted units	traced inputs, rejects and intermediate transfers per accepted output	proske-et-al-2024-die-area
calc_direct_fgas	fluorinated GHG and N2O emissions	calculate each input-gas and by-product emission from measured input, process-specific utilization and by-product formation, abatement connection, destruction or removal efficiency and downtime, or use validated stack measurement; identify the method and factor version	substance input; utilization; by-product factors; DRE; uptime; stack measurements	kg emitted per substance	us-epa-ghgrp-subpart-i; us-epa-semiconductor-industry
calc_htf_inventory	fluorinated heat-transfer-fluid emissions	fugitive emission = opening stock + purchases + other receipts - closing stock - quantities returned, recovered for reuse, destroyed or transferred off site, adjusted for documented inventory corrections	complete HTF inventory and disposition records	kg emitted per HTF substance	us-epa-ghgrp-subpart-i
calc_mass_reconciliation	each foreground process	reconcile product and material inputs with product outputs, separately identified wastes, wastewater, emissions and documented stock change; investigate rather than silently balancing unexplained differences	mass inputs; outputs; wastes; emissions; stock change	reconciliation difference and corrective explanation	iso-14044-2006
calc_family_assignment	IC family metadata	assign logic/micro, memory, analog or mixed-signal according to marketed function and dominant-function rules; document the decision for multifunction devices	product specification; dominant function; die-area or functional evidence	declared IC family stratum	wsts-product-classification-2021

Data Quality Requirements

requirement_id	Applies to	Requirement	Evidence
dq_identity	reference product	Preserve product-family definitions, dominant function, node or process generation, substrate, wafer diameter, die area and count, package route, delivery state, test criterion and Tiangong reference UUID.	product specifications, route records, test release and reference-flow review
dq_temporal	foreground data	Cover one representative reporting period and identify shutdown, ramp, qualification, abnormal-yield and abatement-downtime periods; justify any shorter campaign.	dated meters, MES, inventory and maintenance records
dq_geography	multi-site production	Identify fab, sort, assembly and test geography and the electricity and upstream market used at each site; do not label a global or national average without production weights.	site list, supplier records, electricity contracts and accepted-output mass shares
dq_completeness	material and emission inventory	Reconcile all major substrate, chemical, gas, water, energy, package-material, waste, wastewater and direct-emission records; record missing coverage and do not fill it with a narrow chip or wafer proxy.	purchase-to-stock balances, meters, waste manifests, emissions model and reconciliation report
dq_yield	sequential production	Preserve wafer, die, assembly and final-test genealogy and yields so rejected production burdens remain assigned to accepted output of the same stratum.	wafer maps, lot genealogy, assembly and test yield reports
dq_direct_emissions	fluorinated gases, N2O, HAPs and HTFs	Document substance identity, process type, calculation or measurement method, abatement routing, DRE evidence, uptime and by-product treatment; disclose any regulatory default factor and version.	stack tests, mass-flow or purchase records, abatement and method records
dq_technology	category aggregation	Demonstrate representation of every claimed IC family and materially different node, die-area, substrate, package and geography stratum; unrepresented families shall be excluded from the dataset claim.	production mix, product master, route matrix and coverage assessment
dq_source_traceability	external and upstream data	Retain source version, geography, technology, age, access date and substitution rationale for every upstream dataset and external method.	dataset registry and source log

9. Validation Rules

rule_id	applies_to	rule	source_ids
validate_reference_identity	reference_flow	Reference output shall be exactly 1 kg of accepted bc98e461-2434-4229-8788-7ffb5c4b9a2e using Mass 93a60a56-a3c8-11da-a746-0800200b9a66, Units of mass 93a60a57-a4c8-11da-a746-0800200c9a66, and unit kg.
validate_required_qualifiers	dataset_metadata	Reject a package missing any required family, function, node, substrate, wafer, die, package or bare-die state, test, geography, reporting-period, electricity-mix or abatement qualifier.	wsts-product-classification-2021; proske-et-al-2024-die-area
validate_delivery_state	reference_product	Verify that reference output is a saleable electrically tested IC and that packaged or tested-bare-die delivery state is explicit; reject an untested wafer, intermediate die, smart-card module, leadframe, PCB or complete equipment proxy.	us-epa-semiconductor-neshap; wsts-product-classification-2021
validate_no_narrow_proxy	representativeness	Reject a category-average claim derived from one chip, one wafer, one family, one package, one application or one route unless the dataset claim is explicitly narrowed to that stratum.	proske-et-al-2024-die-area; wsts-product-classification-2021
validate_process_coverage	process_inventory	Verify route coverage for wafer fabrication, sort and dicing, assembly and packaging or declared tested-bare-die handling, final test, delivery preparation, wastes, wastewater and direct emissions.	us-epa-semiconductor-neshap; epd-international-pcr-2024-06
validate_yield_and_mass	calculation_results	Require sequential yield reconciliation and process mass reconciliation; investigate unexplained differences and prohibit zero-loss assumptions without measured evidence.	iso-14044-2006; proske-et-al-2024-die-area
validate_direct_gases	fab_and_test_emissions	When fluorinated gases, N2O or HTFs are used, require substance-specific input and emission records, by-product treatment, abatement DRE and downtime; reject purchased-gas-equals-emission shortcuts unless the cited method explicitly requires that conservative case.	us-epa-semiconductor-industry; us-epa-ghgrp-subpart-i
validate_allocation	shared_burdens	Require subdivision or a documented causal allocation driver for shared fab, assembly and test burdens and require accepted-output mass weights for final aggregation; reject an undocumented mass, revenue or single-wafer proxy.	iso-14044-2006; proske-et-al-2024-die-area
validate_foreground_evidence	quantitative_inventory	Require foreground records for all quantities in this PCR. Do not substitute uncited generic values or provisional estimates for missing product-family, node, site, yield, utility, material or emission data.	iso-14044-2006; iec-63366-2025

10. Published Dataset Profile

Field	Value
dataset_role	Cradle-to-manufacturing-gate foreground data package that may be published as a secondary_dataset or background_dataset after review
downstream_use	Construction of process and lifecyclemodel inventories for computing, communications, power electronics, intelligent devices and other systems consuming electronic integrated circuits
allowed_use	Use for the declared IC family, node or process-generation range, substrate, wafer diameter, die construction, package or bare-die delivery state, geography, reporting period and production mix; aggregation is allowed only with compatible strata and explicit mass weights
excluded_use	Do not use as a proxy for semiconductor wafers, discrete devices, smart-card modules, printed circuit boards or complete equipment; do not support comparative claims across materially different performance, family, node, die-area, package, geography or abatement profiles without equivalence review
required_metadata	All reference-flow qualifiers; included sites and route shares; foreground and upstream boundary; sequential yields; allocation drivers; electricity mixes; abatement systems; dataset and source versions; cut-offs; data gaps; uncertainty and representativeness assessment
required_quality_disclosure	Coverage by family and production stratum; temporal and geographic coverage; measured versus calculated shares; material and yield reconciliation; direct-gas method and factor versions; abatement DRE and downtime evidence; unresolved flow UUIDs; excluded operations and missing data
update_trigger	Material change in family mix, technology node, substrate or wafer diameter, die area or chiplet construction, package route, site or electricity mix, process chemistry, yield, abatement configuration, allocation method, regulatory emissions method, or evidence older than the declared representativeness period

11. Data Sources

Source id	Type	Reference	Used for
iso-14044-2006	standard	ISO 14044:2006, Environmental management - Life cycle assessment - Requirements and guidelines, confirmed 2022, https://www.iso.org/standard/38498.html (retrieved 2026-08-09)	LCI scope, data quality, allocation, mass balance, reporting and review rules
iec-63366-2025	standard	IEC 63366:2025, Product category rules for life cycle assessment of electrical and electronic products and systems, https://webstore.iec.ch/en/publication/67691 (retrieved 2026-08-09)	Horizontal EEPS PCR, complementary product-specific rules, scenarios and environmental-declaration context
epd-international-pcr-2024-06	standard	International EPD System PCR 2024:06, Electronic and electric equipment, and electronic components (non-construction), version 1.0.1, valid to 2029-10-28, https://www.environdec.com/pcr-library/pcr_23d2c7b4-04cd-4a57-8ca7-08d9b348866f (retrieved 2026-08-09)	Electronics-sector scope, declared-unit use and manufacturing-gate dataset profile
wsts-product-classification-2021	official_guidance	World Semiconductor Trade Statistics, Product Classification 2021, Semiconductor Industry Association, https://www.semiconductors.org/wp-content/uploads/2021/02/Product_Classification_2021.pdf (retrieved 2026-08-09)	Logic/micro, memory, analog and dominant-function family parameterization and exclusions
us-epa-semiconductor-neshap	official_guidance	U.S. EPA, Semiconductor Manufacturing: National Emission Standards for Hazardous Air Pollutants, https://www.epa.gov/stationary-sources-air-pollution/semiconductor-manufacturing-national-emission-standards-hazardous (retrieved 2026-08-09)	Manufacturing boundary from wafer substrate through wafer fabrication, test and assembly; hazardous air pollutant inclusion
us-epa-semiconductor-industry	official_guidance	U.S. EPA, Semiconductor Industry, https://www.epa.gov/eps-partnership/semiconductor-industry (retrieved 2026-08-09)	Fluorinated-gas use, etch and chamber-clean processes, by-product and abatement variability
us-epa-ghgrp-subpart-i	official_guidance	U.S. EPA, Greenhouse Gas Reporting Program Subpart I Information Sheet, https://www.epa.gov/ghgreporting/subpart-i-information-sheet (retrieved 2026-08-09)	Substance-specific input, by-product, HTF, N2O, abatement, production-area and calculation data requirements
proske-et-al-2024-die-area	literature	Proske, M. et al. (2024), Investigation of Semiconductor Die Area as a Reference Variable for LCA, DOI: 10.23919/EGG62010.2024.10631237, https://doi.org/10.23919/EGG62010.2024.10631237	Die area and technology node as representativeness, allocation and data-quality parameters