Sound, video, network and similar cards for automatic data processing machines

1. Scope and Applicability

This PCR guides construction of cradle-to-factory-gate foreground data packages for finished, tested expansion cards used in automatic data processing machines. Covered card archetypes include network interface cards, sound or audio cards, graphics or video cards, and AI, data-centre, high-performance-computing, or other accelerator cards when supplied as cards. Every dataset shall identify one card archetype and shall separately describe the primary chip and package, printed circuit board, onboard memory, cooling assembly, external interface assembly, and remaining support components.

This leaf is technically heterogeneous. A single GPU card, network card, video card, sound card, chip, or generic electronic assembly is not a representative proxy for the whole category. A production-weighted mix is allowed only for a declared family whose members have the same primary function, host interface, production route, and acceptance basis; weights and configuration differences shall be disclosed.

The reference boundary starts with purchased materials, components, and services at the reporting manufacturing boundary and ends with a finished card accepted at the factory gate. Semiconductor or bare-PCB fabrication is included only when performed by, or under the operational control of, the reporting organization; otherwise those items enter as supplier-specific upstream product datasets. Use and end-of-life are outside this cradle-to-gate data package.

2. Product Category Identity

Field	Value
canonical_pcr_id	pcr.metal-products-machinery-and-equipment.office-accounting-and-computing-machinery.sound-video-network-and-similar-cards-for-automatic-data-processing-machines
classification_refs	CPC 3.0 45281, Sound, video, network and similar cards for automatic data processing machines
covered_products	Finished expansion cards for automatic data processing machines, including network, sound/audio, graphics/video, AI/data-centre/HPC accelerator, and functionally similar cards
excluded_products	Bare dies, integrated circuits or semiconductor packages; bare printed circuit boards; complete computers or servers; hubs, routers and gateways; standalone external peripherals; storage units; cables or power supplies sold separately; and software-only services
representative_product	One declared, finished and acceptance-tested card archetype and configuration; no subtype represents the whole CPC leaf
production_route	Purchased component receipt and kitting, optional controlled bare-PCB and semiconductor/package fabrication, printed-board assembly, thermal/mechanical/interface assembly, firmware loading, test, acceptance, and dispatch
market_state	Finished, tested card at the manufacturing factory gate; detachable packaging and separately supplied accessories are not part of net card mass

3. Reference Flow

Field	Value
What	Production of a finished, electrically functional and acceptance-tested expansion card of one declared card type and configuration for an automatic data processing machine
How much	1 kg net accepted card, excluding detachable packaging, separately supplied cables, spares, and accessories
How well	Meets the declared electrical, functional, thermal, host-interface, connector, firmware, and factory acceptance specification for the named card configuration
How long or cycle	One defined production lot or reporting year at the factory gate; no use-life claim is included in this cradle-to-gate reference flow
reference_flow_link	The quantitative reference is the exact Tiangong CPC 3.0 45281 product flow stated below

Field	Value
Reference amount	1 kg
Reference product flow	cc906112-5ebd-437c-b701-88faeeac2f81 — Sound, video, network and similar cards for automatic data processing machines
Reference flow property	93a60a56-a3c8-11da-a746-0800200b9a66 — Mass
Reference unit group	93a60a57-a4c8-11da-a746-0800200c9a66 — Units of mass
Reference unit	kg
Required qualifiers	card_type; primary_function; host_interface_and_form_factor; performance_class; primary_chip_model_and_package_technology; die_or_package_count_and_mass_basis; pcb_area_layer_count_thickness_surface_finish_and_mass; onboard_memory_technology_capacity_device_count_and_mass; cooling_architecture_materials_and_mass; external_connector_and_port_type_count_and_included_modules; support_component_groups_and_mass; firmware_version_and_test_profile; net_card_mass; manufacturing_site_country_and_reporting_period; production_route; yield_and_allocation_basis; packaging_exclusion

When constructing a foreground data package, the items listed in Required qualifiers must be declared in dataset metadata, process notes, reference flow comment, product description, or an equivalent data package field. Missing required qualifiers make the reference flow definition incomplete for that data package.

4. Measurement and Unit Rules

rule_id	Applies to	Required property	Required unit	Rule
reference_net_mass	Accepted reference product	Mass	kg	Weigh accepted cards without detachable packaging, separately supplied cables, spares, or accessories. Normalize the summed accepted net card mass to 1 kg.
component_layer_mass	Primary chips/packages, PCB, onboard memory, cooling, interfaces, and support components	Mass	kg	Record the measured or supplier-declared dry mass for every required layer separately; do not bury a layer in a generic electronics total.
count_area_to_mass	Parts initially recorded by count or PCB area	Mass	kg	Convert count or area to mass using lot-specific weighing or configuration-specific supplier data and retain the conversion record, sample size, and uncertainty.
process_energy_preservation	Electricity, heat, fuel, and compressed-air use	Energy	kWh or MJ	Preserve the metered unit and energy carrier before conversion; record conversion factors and do not report power ratings as energy use.
water_and_process_materials	Water, solder, flux, cleaners, coatings, thermal-interface materials, and fabrication chemicals	Mass or volume	kg, m3, or recorded compatible unit	Use purchase, issue, return, recovery, and stock-change records reconciled to the process and reporting period.
waste_and_release_mass	Scrap, rejected units, spent materials, wastewater constituents, and direct releases	Mass	kg	Measure or calculate each distinct waste or release stream before treatment and preserve destination or receiving compartment.
performance_qualifiers	Card function and acceptance	Declared technical performance	Declared SI or interface unit	Record metrics appropriate to card type, such as link rate and port count, audio channel/sample specification, graphics/compute throughput class, memory capacity, thermal design basis, and test profile; never compare different archetypes on mass alone.
production_mix_control	Product-family or configuration mix	Mass share	kg/kg	A mix shall use accepted net mass weights from the same route and period. Disclose every included configuration and prohibit averaging across different primary functions or host interfaces.

5. System Boundary

Boundary Abstraction

Field	Value
declared_starting_condition	Purchased raw materials, components, subassemblies, utilities, fuels, water, and transport services received at the reporting manufacturing boundary
starting_condition_role	Supplier-specific upstream datasets are linked at receipt; controlled in-house fabrication is modelled as foreground processes
product_classification_scope	Finished CPC 3.0 45281 expansion cards only, with a declared card type and configuration
recursive_input_rule	Purchased chip packages, PCB, memory, cooling, interface and support components require upstream datasets but are not recursively reclassified as the finished card
upstream_dataset_requirement	Prefer supplier- and technology-specific datasets for semiconductor packages, PCB, memory, thermal assemblies and connectors; disclose any fallback separately by layer
disclosure	Declare organizational control, cut-offs, geography, technology, reporting period, yields, allocation, excluded packaging and unresolved flow identities

rule_id	Applies to	Rule	source_ids
boundary_factory_gate	All datasets	Include receipt, kitting, assembly, thermal/mechanical/interface integration, firmware loading, test, rework, acceptance, internal handling, and dispatch activities required to produce the accepted card at the factory gate.	itu-t-l1410-2024; eu-pef-2021-2279
boundary_component_hierarchy	Bill of materials and upstream links	Keep primary chip/package, PCB, onboard memory, cooling, interface and support-component layers distinct. Report layer mass and data source; no generic electronic-part total may replace them.	itu-t-l1410-2024; ipc-1752a-2018; iec-62474-2018
boundary_controlled_fabrication	Bare-PCB and semiconductor/package fabrication	Include these as foreground only where the reporting organization has operational control and site records. Otherwise use supplier-specific upstream product datasets and do not invent wafer-fab or PCB-fab inventories.	itu-t-l1410-2024; eu-pef-2021-2279
boundary_transport_packaging	Inbound transport and dispatch packaging	Include inbound transport and packaging production or use as separate flows. Exclude detachable packaging from the 1 kg reference product mass while retaining its inventory burden.	eu-pef-2021-2279
boundary_use_eol	Use, maintenance, reuse, recycling and disposal	Exclude from this cradle-to-gate package. A downstream lifecycle model may add them only with card-type-specific power, workload, lifetime, replacement and end-of-life scenarios.	itu-t-l1410-2024
boundary_no_proxy	Classification and representative product	Do not substitute a bare IC, bare PCB, complete computer/server, hub/router/gateway, external peripheral, or a single GPU/network/video/sound card for this category.	un-cpc-3-2025

6. Process Inventory Structure

Process Map

process_id	process_name	inclusion	inclusion_condition	role	quantitative_reference
component_receipt_and_kitting	Component receipt, verification and kitting	required	Always	Preserve the product-specific bill of materials and supplier links by required layer	Mass of issued layer components per accepted card mass
bare_pcb_fabrication	Bare printed circuit board fabrication	conditional	Include only when performed by or under operational control of the reporting organization	Model controlled laminate, imaging, etching, plating, finishing and inspection activities	Mass of accepted bare PCB issued to assembly
semiconductor_package_fabrication	Semiconductor die and package fabrication	conditional	Include only when performed by or under operational control of the reporting organization	Model controlled wafer/die, substrate, packaging, test and yield activities	Mass or count of accepted packages issued to assembly, reconciled to mass
printed_board_assembly	Printed board assembly	required	Always	Mount, solder, clean, coat and inspect PCB assemblies	Mass of accepted assembled PCBA
thermal_mechanical_interface_assembly	Thermal, mechanical and interface assembly	required	Always	Add cooling, brackets, housings, external connectors and included modules	Mass of mechanically complete cards
firmware_test_and_acceptance	Firmware loading, functional test and acceptance	required	Always	Establish finished-card function, performance class and accepted yield	Mass of accepted finished cards
packaging_and_dispatch	Packaging and factory-gate dispatch	required	Always	Record protective packaging and release the reference product without adding packaging to its net mass	1 kg net accepted card at factory gate

Process: Component receipt, verification and kitting (component_receipt_and_kitting)

Inputs

Product flows

Primary chips and packages (primary_chip_package_input)

Record each primary processor, controller, accelerator, codec or comparable functional chip by model, package technology, count and dry mass. This layer may not be replaced by an average IC proxy.

• Selected flow: Supplier-specific primary chip or semiconductor-package product flow selected during dataset construction
• Flow property / unit: Mass / kg; retain piece count as a qualifier
• Amount rule: Foreground received-and-issued mass reconciled to the declared configuration and accepted production
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Accepted net card mass
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_product_specific_bom
• Sources: itu-t-l1410-2024; eu-pef-2021-2279; ipc-1752a-2018

Bare printed circuit board (bare_pcb_input)

Record board area, layer count, thickness, surface finish, panel yield and accepted dry mass for the exact card design.

• Selected flow: Supplier- and technology-specific bare PCB product flow selected during dataset construction
• Flow property / unit: Mass / kg; retain area in m2
• Amount rule: Foreground issued mass plus attributable incoming rejects, normalized to accepted production
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Accepted net card mass
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_product_specific_bom
• Sources: itu-t-l1410-2024; ipc-1752a-2018

Onboard memory (onboard_memory_input)

Record memory technology, capacity, device count, package style and mass separately from the primary chip layer.

• Selected flow: Supplier-specific onboard-memory product flow selected during dataset construction
• Flow property / unit: Mass / kg; retain capacity and count qualifiers
• Amount rule: Foreground issued mass for the declared configuration, including attributable incoming rejects
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Accepted net card mass
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_product_specific_bom
• Sources: itu-t-l1410-2024; ipc-1752a-2018

Cooling assembly (cooling_assembly_input)

Record heat sink, heat pipe or vapour chamber, fan, shroud, cold plate, liquid-cooling fitting and thermal-interface material by included configuration and mass.

• Selected flow: Supplier-specific cooling-component product flows selected by material and assembly type
• Flow property / unit: Mass / kg
• Amount rule: Foreground issued dry mass for the declared cooling architecture
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Accepted net card mass
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_product_specific_bom
• Sources: itu-t-l1410-2024; ipc-1752a-2018

External interfaces and included modules (interface_component_input)

Record host edge connector, network/audio/video ports, transceiver cages or included modules, brackets and interface-specific components by type, count and mass.

• Selected flow: Supplier-specific connector, port, bracket and included-module product flows
• Flow property / unit: Mass / kg; retain count and interface qualifiers
• Amount rule: Foreground issued mass for the declared configuration
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Accepted net card mass
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_product_specific_bom
• Sources: ipc-1752a-2018; iec-62474-2018

Support electronic and mechanical components (support_component_input)

Record passive components, power-delivery parts, oscillators, auxiliary controllers, shielding, fasteners and other residual components in disclosed groups; this residual must not absorb any required layer.

• Selected flow: Supplier-specific support-component product flows grouped by technology and material where individual modelling is impracticable
• Flow property / unit: Mass / kg
• Amount rule: Difference between measured complete-card mass and all separately measured required layers, checked against procurement and placement records
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: Accepted net card mass
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_product_specific_bom
• Sources: itu-t-l1410-2024; ipc-1752a-2018

Waste flows

Incoming packaging and rejected components (incoming_rejects_and_packaging)

Record receiving packaging and components rejected before assembly by material or component family and treatment destination.

• Selected flow: Site-specific waste flows selected by material and destination
• Flow property / unit: Mass / kg
• Amount rule: Weighed or documented rejected mass and packaging mass for the reporting period
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted net card mass
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_yield_waste_rework
• Sources: eu-pef-2021-2279

Elementary flows

Outputs

Product flows

Kitted component set (kitted_component_set)

Transfer the verified component layers to printed-board and final assembly without treating the kit as an external co-product.

• Selected flow: Internal intermediate kitted component set
• Flow property / unit: Mass / kg
• Amount rule: Sum of issued component-layer masses after receiving rejects
• Value mode: Calculated value (calculated_value)
• Specificity: Product-specific (product_specific)
• Normalization basis: Accepted net card mass
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_product_specific_bom
• Sources: mass-balance-identity

Waste flows

Elementary flows

Process: Bare printed circuit board fabrication (bare_pcb_fabrication)

Inputs

Product flows

PCB fabrication materials and utilities (pcb_fabrication_inputs)

When this conditional foreground process applies, record laminates, copper, films, masks, finishes, plating and etching chemicals, cleaning agents, water and each energy carrier separately for the controlled line.

• Selected flow: Site- and technology-specific material, chemical, water and utility flows selected during dataset construction
• Flow property / unit: Mass, volume, or energy / kg, m3, kWh, or MJ
• Amount rule: Metered, purchased-and-issued, or stock-balanced amounts allocated to the declared board family
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted bare PCB mass issued to card assembly
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_process_materials_water
• Sources: eu-pef-2021-2279; iec-62474-2018

Waste flows

PCB scrap, spent baths and wastewater (pcb_fabrication_waste)

Keep solid board scrap, spent process materials, treatment residues and wastewater distinct by treatment route.

• Selected flow: Site-specific waste and wastewater flows selected by composition and destination
• Flow property / unit: Mass or volume / kg or m3
• Amount rule: Weighed, metered, or treatment-record amount reconciled to the controlled fabrication line
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted bare PCB mass issued to card assembly
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_yield_waste_rework
• Sources: mass-balance-identity

Elementary flows

Direct PCB-fabrication releases (pcb_fabrication_direct_releases)

Record measured direct releases to air and water after site treatment by named substance and receiving compartment; never infer them from purchased chemical mass alone.

• Selected flow: Substance- and compartment-specific elementary flows selected during dataset construction
• Flow property / unit: Mass / kg
• Amount rule: Site monitoring or compliant engineering calculation for the reporting period
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted bare PCB mass issued to card assembly
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_water_emissions
• Sources: eu-pef-2021-2279

Outputs

Product flows

Accepted bare PCB (accepted_bare_pcb)

Transfer only inspected bare boards meeting the declared design and finish specification to assembly.

• Selected flow: Internal accepted bare PCB for the declared card configuration
• Flow property / unit: Mass / kg
• Amount rule: Measured accepted dry mass after fabrication yield losses
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Process output
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_yield_waste_rework
• Sources: mass-balance-identity

Waste flows

Elementary flows

Process: Semiconductor die and package fabrication (semiconductor_package_fabrication)

Inputs

Product flows

Semiconductor fabrication materials and utilities (semiconductor_fabrication_inputs)

When this conditional foreground process applies, record wafers or dies, substrates, leadframes, encapsulants, bonding materials, process gases and chemicals, ultrapure water, and each utility separately for the controlled technology route.

• Selected flow: Site- and technology-specific semiconductor material, chemical, water and utility flows selected during dataset construction
• Flow property / unit: Mass, volume, or energy / compatible recorded unit
• Amount rule: Metered or production-accounted amounts allocated to the declared die/package family using documented tool and yield records
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted package mass or count issued to card assembly, reconciled to mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_process_materials_water
• Sources: itu-t-l1410-2024; eu-pef-2021-2279

Waste flows

Semiconductor scrap and spent materials (semiconductor_fabrication_waste)

Record rejected wafers, dies and packages, spent chemicals, abatement residues and wastewater separately by treatment route.

• Selected flow: Site-specific waste flows selected by composition and destination
• Flow property / unit: Mass or volume / compatible recorded unit
• Amount rule: Production and treatment records reconciled to controlled fabrication yields
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted package mass or count issued to card assembly, reconciled to mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_yield_waste_rework
• Sources: mass-balance-identity

Elementary flows

Direct semiconductor-fabrication releases (semiconductor_direct_releases)

Record measured releases after abatement by substance and compartment, including any process-gas destruction basis; do not derive releases solely from purchases.

• Selected flow: Substance- and compartment-specific elementary flows selected during dataset construction
• Flow property / unit: Mass / kg
• Amount rule: Site monitoring or documented engineering calculation for the reporting period
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted package mass or count issued to card assembly, reconciled to mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_water_emissions
• Sources: eu-pef-2021-2279

Outputs

Product flows

Accepted semiconductor packages (accepted_semiconductor_packages)

Transfer tested packages by model and package technology to card assembly.

• Selected flow: Internal accepted semiconductor packages for the declared card configuration
• Flow property / unit: Mass / kg; retain count
• Amount rule: Accepted package mass after fabrication and test yield losses
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Process output
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_yield_waste_rework
• Sources: mass-balance-identity

Waste flows

Elementary flows

Process: Printed board assembly (printed_board_assembly)

Inputs

Product flows

Electronic components and PCB (pcba_component_inputs)

Issue the separately recorded primary chip/package, PCB, memory and support-component layers to the exact board configuration.

• Selected flow: Kitted component layers or controlled-fabrication intermediate outputs
• Flow property / unit: Mass / kg
• Amount rule: Lot-specific issued mass including attributable placement and assembly losses
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Accepted assembled PCBA mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_product_specific_bom
• Sources: itu-t-l1410-2024; eu-pef-2021-2279

Assembly materials and energy (pcba_assembly_materials_energy)

Record solder alloy or paste, flux, adhesives, cleaners, conformal coating and electricity separately for printing, placement, reflow, selective or wave soldering, cleaning, coating and inspection.

• Selected flow: Site-specific assembly material and utility flows selected during dataset construction
• Flow property / unit: Mass or energy / kg, kWh, or MJ
• Amount rule: Issued material and metered energy allocated to the declared assembly route and accepted output
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted assembled PCBA mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_process_materials_water
• Sources: ipc-jstd001j-a610j-2024; eu-pef-2021-2279

Waste flows

Assembly scrap and spent materials (pcba_assembly_waste)

Record rejected boards and components, solder dross, spent wipes, masks, cleaners and coating wastes separately from rework that remains inside the system.

• Selected flow: Site-specific assembly waste flows selected by material and destination
• Flow property / unit: Mass / kg
• Amount rule: Weighed or documented waste generated for the reporting period after accounting for successful internal rework
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted assembled PCBA mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_yield_waste_rework
• Sources: ipc-jstd001j-a610j-2024; mass-balance-identity

Elementary flows

Direct assembly releases (pcba_direct_releases)

Record measured or permitted releases from soldering, cleaning and coating by substance and compartment where they occur.

• Selected flow: Substance- and compartment-specific elementary flows selected during dataset construction
• Flow property / unit: Mass / kg
• Amount rule: Site monitoring or documented engineering calculation, net of captured waste sent to treatment
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted assembled PCBA mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_water_emissions
• Sources: ipc-jstd001j-a610j-2024

Outputs

Product flows

Accepted assembled PCBA (accepted_assembled_pcba)

Transfer inspected PCB assemblies to final mechanical integration.

• Selected flow: Internal accepted assembled PCBA
• Flow property / unit: Mass / kg
• Amount rule: Measured accepted mass after assembly rejects and unrecoverable losses
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Process output
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_yield_waste_rework
• Sources: ipc-jstd001j-a610j-2024

Waste flows

Elementary flows

Process: Thermal, mechanical and interface assembly (thermal_mechanical_interface_assembly)

Inputs

Product flows

PCBA and final assembly layers (final_assembly_inputs)

Combine the accepted PCBA with separately measured cooling, thermal-interface, bracket, housing, external-interface and included-module layers.

• Selected flow: Internal accepted PCBA and supplier-specific final assembly components
• Flow property / unit: Mass / kg; retain component count
• Amount rule: Lot-specific issued mass for the declared final configuration
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Mechanically complete card mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_product_specific_bom
• Sources: itu-t-l1410-2024; ipc-1752a-2018

Final assembly energy and consumables (final_assembly_energy_consumables)

Record electricity, fasteners, adhesives, thermal-interface material and other consumables not already included in purchased subassemblies.

• Selected flow: Site-specific utility and consumable flows selected during dataset construction
• Flow property / unit: Mass or energy / kg, kWh, or MJ
• Amount rule: Metered or issued amount allocated to accepted mechanically complete cards
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Mechanically complete card mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_process_materials_water
• Sources: eu-pef-2021-2279

Waste flows

Mechanical assembly waste (final_assembly_waste)

Record rejected cooling parts, brackets, connectors, modules, fasteners, liners and other assembly residues by destination.

• Selected flow: Site-specific waste flows selected by material and destination
• Flow property / unit: Mass / kg
• Amount rule: Weighed or documented waste after recoverable parts and rework are accounted for
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Mechanically complete card mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_yield_waste_rework
• Sources: mass-balance-identity

Elementary flows

Outputs

Product flows

Mechanically complete card (mechanically_complete_card)

Transfer the assembled configuration to firmware loading and acceptance testing.

• Selected flow: Internal mechanically complete card
• Flow property / unit: Mass / kg
• Amount rule: Measured mass of completed configurations issued to test
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Process output
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_product_specific_bom
• Sources: mass-balance-identity

Waste flows

Elementary flows

Process: Firmware loading, functional test and acceptance (firmware_test_and_acceptance)

Inputs

Product flows

Complete cards and test energy (test_inputs)

Record cards entering test, firmware or configuration image, electricity for test equipment and any consumed test media. Test time alone is not energy.

• Selected flow: Internal mechanically complete cards and site-specific electricity flow
• Flow property / unit: Mass and energy / kg and kWh
• Amount rule: Tested card mass and metered test energy allocated by measured test duration and equipment load where direct metering is unavailable
• Value mode: Calculated value (calculated_value)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted finished card mass
• Basis kind: Process output (process_output)
• Evidence kind: Calculated from collection (calculated_from_collection)
• Collection protocol: cp_test_acceptance
• Sources: ipc-jstd001j-a610j-2024; eu-pef-2021-2279

Waste flows

Unrecoverable test rejects (test_reject_waste)

Record only units and components that leave internal rework as waste; reworked cards remain internal and their extra energy and materials stay in the process inventory.

• Selected flow: Site-specific rejected-card or component waste flow selected by material and destination
• Flow property / unit: Mass / kg
• Amount rule: Weighed unrecoverable rejects after rework disposition
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Accepted finished card mass
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_yield_waste_rework
• Sources: ipc-jstd001j-a610j-2024

Elementary flows

Outputs

Product flows

Accepted finished cards (accepted_finished_cards)

Release only cards that meet the declared electrical, functional, thermal, host-interface, connector, firmware and acceptance specification.

• Selected flow: Exact finished-card configuration prior to detachable packaging
• Flow property / unit: Mass / kg
• Amount rule: Measured accepted net mass after test and final disposition
• Value mode: Foreground record (foreground_record)
• Specificity: Product-specific (product_specific)
• Normalization basis: Process output
• Basis kind: Process output (process_output)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_reference_identity_mass
• Sources: ipc-jstd001j-a610j-2024

Waste flows

Elementary flows

Process: Packaging and factory-gate dispatch (packaging_and_dispatch)

Inputs

Product flows

Accepted cards and protective packaging (dispatch_inputs)

Record accepted card mass and every detachable antistatic bag, tray, cushion, carton, label and pallet material separately; packaging burden stays in the system even though packaging mass is excluded from the reference product.

• Selected flow: Internal accepted cards and material-specific packaging product flows
• Flow property / unit: Mass / kg
• Amount rule: Accepted card mass plus purchased-and-used packaging mass for the same dispatch population
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Net accepted card mass at factory gate
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_packaging
• Sources: eu-pef-2021-2279

Waste flows

Packaging trim and damaged packaging (packaging_waste)

Record packaging waste by material and destination.

• Selected flow: Site-specific packaging waste flows selected by material and destination
• Flow property / unit: Mass / kg
• Amount rule: Weighed or stock-balanced packaging loss
• Value mode: Foreground record (foreground_record)
• Specificity: Site-specific (site_specific)
• Normalization basis: Net accepted card mass at factory gate
• Basis kind: Reference flow (reference_flow)
• Evidence kind: Collected record (collected_record)
• Collection protocol: cp_packaging
• Sources: mass-balance-identity

Elementary flows

Outputs

Product flows

Reference card output (reference_card_output)

The output is the exact CPC 3.0 45281 Tiangong product flow and carries all required card-specific qualifiers.

• Selected flow: cc906112-5ebd-437c-b701-88faeeac2f81 — Sound, video, network and similar cards for automatic data processing machines

• Flow property / unit: 93a60a56-a3c8-11da-a746-0800200b9a66 Mass / kg; unit group 93a60a57-a4c8-11da-a746-0800200c9a66

• Amount rule: Fixed normalization output of 1 kg net accepted card; detachable packaging and separately supplied accessories are excluded from output mass

• Value mode: Fixed value (fixed_value)

• Specificity: Product-specific (product_specific)

• Normalization basis: Reference flow

• Basis kind: Reference flow (reference_flow)

• Evidence kind: Identity reference (identity_reference)

• Collection protocol: cp_reference_identity_mass

• Sources: un-cpc-3-2025; tiangong-flow-verification-2026

• Range: Reference amount

  • Range role: Allowed range (allowed_range)
  • Lower: 1
  • Upper: 1
  • Unit: kg
  • Basis: Net accepted card at factory gate
  • Basis kind: Reference flow (reference_flow)
  • Evidence kind: Source rule (source_rule)
  • Sources: tiangong-flow-verification-2026

Waste flows

Elementary flows

7. Allocation and Co-product Handling

rule_id	Applies to	Rule	source_ids
allocation_avoid	All foreground processes	First subdivide lines, tools, meters, batches and records to avoid allocation between card configurations and unrelated products.	eu-pef-2021-2279
allocation_physical_driver	Shared assembly, test and facility activity	When subdivision is not practicable, use a measured causal driver such as machine time multiplied by measured load, placement count, oven occupancy, test duration and load, treated volume, or floor-area-time for residual facility services.	eu-pef-2021-2279
allocation_yield_and_rework	Rejects, yield loss and rework	Attribute material, energy and treatment associated with normal rejects and rework to accepted output of the same configuration and period. Do not credit internal rework as a co-product.	mass-balance-identity
allocation_recovered_material	Sold scrap or recovered materials	Keep collection and treatment burdens in the generating process. Apply any substitution or recycling credit only in a downstream method that explicitly requires it, and disclose the method separately.	eu-pef-2021-2279
allocation_no_category_average	Product families	Do not allocate or average across different primary functions, host interfaces, semiconductor technologies, cooling architectures, or acceptance profiles merely because they share CPC 45281.	un-cpc-3-2025; itu-t-l1410-2024

8. Foreground Data Collection, Calculation, and Quality Rules

Data Collection Protocols

protocol_id	process_id	flow_role	record_type	raw_fields	collection_method	unit	frequency	temporal_coverage	site_scope	aggregation_rule	quality_evidence
cp_reference_identity_mass	firmware_test_and_acceptance; packaging_and_dispatch	Accepted reference product	Scale and acceptance records	configuration_id, serial_or_lot, gross_card_mass, detachable_items_mass, net_card_mass, acceptance_status	Calibrated weighing linked to final acceptance	kg	Each lot or statistically justified sample	Same reporting period	Each manufacturing site	Sum accepted net mass only; report sampling expansion	Calibration record, sample plan, acceptance log
cp_product_specific_bom	component_receipt_and_kitting; all assembly processes	Required component layers	Engineering BOM and mass roll-up	part_number, revision, layer, quantity, measured_or_declared_mass, unit, source, effective_date	Freeze the exact BOM revision and reconcile to measured card mass	kg plus count	Each configuration or engineering change	Effective production period	Each product and site	Aggregate only within the six required layers plus disclosed support groups	Approved BOM, change record, mass reconciliation
cp_supplier_layer_data	component_receipt_and_kitting	Purchased components	Supplier declaration and upstream dataset	supplier, site, part_number, technology, composition, mass, declaration_standard, dataset_id, validity	Collect part-specific supplier declarations and datasets; document fallback by layer	Native and kg	Supplier or design change	Valid for reporting period	Named supplier/site where available	No cross-layer or cross-technology substitution	Supplier declaration, IEC/IPC data, dataset review
cp_process_energy	Controlled fabrication, assembly, test and dispatch	Utilities	Meter, tool log, and calculation	meter_id, carrier, start, end, consumption, tool_state, load, operating_time, allocation_driver	Prefer submetering; otherwise calculate from measured load and operating time and reconcile to site meter	kWh, MJ	Continuous, batch, or shift	Representative reporting period	Each controlled site/process	Sum by carrier; allocate with declared causal driver	Meter calibration, invoices, tool logs, reconciliation
cp_process_materials_water	Controlled fabrication and assembly	Consumables and water	Purchase, issue, return, recovery and stock records	material_id, composition, opening_stock, purchases, issues, returns, recovery, closing_stock, process	Stock-balance each named material and assign to process	kg, m3, or native unit	Batch or monthly	Full reporting period	Each controlled site/process	Opening plus purchases minus closing, returns and transfers	Inventory ledger, issue tickets, composition record
cp_water_emissions	Controlled fabrication and assembly	Water and direct releases	Metering, monitoring and permit records	source_or_substance, quantity, unit, compartment, treatment, sampling_method, detection_limit, period	Measure intake/discharge and direct releases; use documented compliant calculation where monitoring is unavailable	m3, kg	Permit or operational frequency	Full reporting period	Each emission point	Sum by substance, compartment and treatment; handle non-detects explicitly	Laboratory report, permit return, calculation sheet
cp_yield_waste_rework	All manufacturing processes	Yield, rejects, rework and waste	Manufacturing execution and waste records	input_count_mass, accepted_count_mass, reject_reason, rework_route, waste_mass, destination, recovery	Reconcile input, accepted output, internal rework and exiting waste	Count and kg	Each lot, monthly reconciliation	Full reporting period	Each process/site	Do not double count rework; sum exiting waste by type and destination	Yield report, weigh ticket, waste manifest, reconciliation
cp_test_acceptance	firmware_test_and_acceptance	Function and quality	Test system and disposition records	firmware_version, test_profile, interface, performance_metric, threshold, result, duration, power_or_energy, disposition	Link automated or controlled manual tests to configuration and accepted mass	Declared technical unit, seconds, kWh	Each unit or justified sampling plan	Same production period	Each test route	Report pass, rework and scrap populations separately	Test procedure, calibration, test log, disposition
cp_packaging	Receipt and dispatch	Packaging	Packaging specification and stock balance	material, item_mass, item_count, recycled_content, reusable_cycles, issued, wasted, destination	Weigh representative items and reconcile purchased/issued quantities	kg	Packaging change or monthly	Full reporting period	Each dispatch site	Sum by material and reusable-use basis; never add to net card mass	Packaging specification, scale record, stock ledger
cp_allocation_drivers	Shared operations	Allocation	Meter, MES and accounting records	shared_resource, total_quantity, product_quantity, driver, driver_total, rationale	Select and document a physical causal driver before allocation	Native driver unit	Each reporting period	Same as shared activity	Each shared process/site	Allocated amount equals shared total multiplied by product driver share	Driver study, meter/tool logs, allocation calculation

Calculation Rules

rule_id	Applies to	Formula or rule	Inputs	Output	source_ids
calc_reference_normalization	All inventory rows	normalized_amount = reporting_period_amount / accepted_net_card_mass_kg	Reporting-period amount; accepted net card mass	Amount per 1 kg reference flow	tiangong-flow-verification-2026
calc_layer_mass_reconciliation	Product-specific BOM	residual_support_mass = measured_net_card_mass - sum(primary_chip_package, pcb, memory, cooling, interface); investigate a negative or unexplained residual before use	Measured card mass; separately measured required layers	Disclosed support-component mass and reconciliation difference	mass-balance-identity
calc_count_to_mass	Count-based parts	part_mass = accepted_part_count * configuration_specific_unit_mass; use sampled weighing only with documented sample size and variability	Count; unit mass	Part mass in kg	mass-balance-identity
calc_area_to_pcb_mass	PCB recorded by area	pcb_mass = accepted_board_area * measured_areal_mass; retain layer count, thickness and finish	Accepted area; design-specific areal mass	PCB mass in kg	mass-balance-identity
calc_energy_from_load_time	Unmetered tool energy	energy = measured_average_load * operating_time; reconcile tool totals to the parent meter and allocate standby explicitly	Load, time, parent meter	Energy by carrier	eu-pef-2021-2279
calc_stock_balance	Process materials and packaging	consumed = opening_stock + purchases + inbound_transfers - closing_stock - returns - outbound_transfers - recovered_for_reuse	Stock and transaction records	Process consumption	mass-balance-identity
calc_yield	Each process	mass_yield = accepted_output_mass / total_input_mass_of_corresponding_product_material; report count yield separately where relevant	Input, accepted output, rejects	Mass yield and count yield	mass-balance-identity
calc_shared_allocation	Shared activity	allocated_amount = shared_amount * product_driver / sum(all_product_drivers)	Shared amount; causal driver values	Allocated foreground amount	eu-pef-2021-2279

Data Quality Requirements

requirement_id	Applies to	Requirement	Evidence
dq_configuration_specificity	Reference product and BOM	Identify card type, configuration, chip/package, PCB, memory, cooling and interfaces at the granularity used for inventory; generic leaf averages are unacceptable.	BOM revision, product specification, configuration list
dq_technological_representativeness	Upstream component datasets	Match semiconductor technology/package, PCB construction, memory technology, cooling design and connector/module type; disclose every proxy by layer.	Supplier declaration, dataset metadata, proxy justification
dq_geographical_representativeness	Manufacturing and upstream electricity	Use the actual site and electricity-supply geography where known; disclose supplier-location uncertainty.	Site records, supplier/site metadata, electricity contract
dq_temporal_representativeness	Foreground records	Use one coherent recent production period and align BOM, energy, yield, waste and test populations.	Reporting-period ledger and reconciliation
dq_completeness	All required processes and layers	Account for every required component layer, required process, conditional controlled process, energy carrier, material waste, wastewater and direct release; document justified zeroes and exclusions.	Completeness matrix and signed review
dq_mass_balance	Product layers and each process	Reconcile input, output, waste, rework and inventory change. Investigate unexplained differences rather than assigning them silently to support components.	Mass-balance worksheet and variance disposition
dq_measurement_quality	Mass, energy, water and emissions	Record instrument, calibration, sampling, detection limit, conversion and uncertainty appropriate to each record.	Calibration and sampling records
dq_supplier_evidence	Purchased components	Prefer part-specific material declarations and upstream datasets. A declaration supplies composition evidence but does not replace manufacturing energy, yield, waste or emission data.	Supplier declaration and separate upstream dataset review
dq_no_unreviewed_defaults	Missing quantitative data	Do not use a category-wide default or reasoned estimate in a reviewed dataset unless separately approved, labelled replaceable, and supported for the declared card archetype.	Gap register, approval and replacement plan

9. Validation Rules

rule_id	Applies to	Rule	source_ids
validation_identity	Dataset identity	Confirm CPC 3.0 45281, exact reference product UUID, Mass property UUID, Units of mass UUID and kg; reject narrow or broader proxy products.	un-cpc-3-2025; tiangong-flow-verification-2026
validation_qualifiers	Reference flow	Fail completeness when any required qualifier is absent or when card type, primary function, host interface, configuration, site or reporting period is ambiguous.	itu-t-l1410-2024
validation_layer_separation	Bill of materials	Confirm separate chip/package, PCB, memory, cooling, interface and support-component records and a reconciliation to measured net card mass.	itu-t-l1410-2024; ipc-1752a-2018; mass-balance-identity
validation_no_leaf_extrapolation	Representativeness	Reject a claim that one GPU, network, video, sound or accelerator card represents all CPC 45281; validate any family mix against the homogeneity and weighting rules.	un-cpc-3-2025; itu-t-l1410-2024
validation_boundary_control	Conditional fabrication	Verify operational control evidence for foreground bare-PCB or semiconductor/package fabrication; otherwise require supplier upstream links and exclude invented foreground inventories.	eu-pef-2021-2279
validation_process_completeness	Process map	Confirm all required processes and every applicable conditional process are present, with explicit zero or exclusion evidence for non-applicable rows.	eu-pef-2021-2279; ipc-jstd001j-a610j-2024
validation_yield_rework_waste	Manufacturing inventory	Reconcile accepted output, rejects, internal rework and exiting waste; prevent double counting of reworked cards and recovered components.	mass-balance-identity
validation_energy_material_emissions	Site inventory	Confirm energy is not inferred from power alone, materials are stock-balanced, and direct releases are compartment-specific and not inferred solely from purchases.	eu-pef-2021-2279
validation_allocation	Shared activity	Confirm subdivision was attempted, the chosen driver is physically causal, totals reconcile, and no averaging crosses different primary functions or host interfaces.	eu-pef-2021-2279
validation_packaging_reference_mass	Dispatch output	Confirm detachable packaging burdens are included as inventory while packaging, separate cables, spares and accessories are excluded from the 1 kg reference product mass.	eu-pef-2021-2279; mass-balance-identity
validation_source_and_uuid_status	Publication review	Verify source access dates and exact flow identities. Treat unresolved non-reference UUIDs and absent quantitative evidence as disclosed incompleteness, not permission to substitute a generic flow or estimate.	tiangong-flow-verification-2026

10. Published Dataset Profile

Field	Value
dataset_role	Product- and site-specific cradle-to-factory-gate foreground data package for one declared CPC 3.0 45281 card archetype and configuration
downstream_use	Construction of reviewed process and lifecyclemodel projections for electronic equipment, AI/data-centre infrastructure, and related systems
allowed_use	Comparison or aggregation only among configurations with equivalent function, performance basis, host interface, boundary, geography, period and data quality; lifecycle models may add explicit use and end-of-life scenarios
excluded_use	Bare IC, bare PCB, complete computer/server, hub/router/gateway or external-peripheral modelling; representing the entire CPC leaf with one card subtype; use-phase claims from this cradle-to-gate package alone
required_metadata	All reference-flow qualifiers; CPC identity; exact UUID chain; BOM revision; card type and configuration; production route; site/geography/period; operational-control statement; yield; allocation; supplier-data status; packaging exclusion
required_quality_disclosure	Layer-specific upstream coverage and proxies; primary versus secondary data; measurement and sampling basis; missing non-reference UUIDs; mass-balance variance; conditional-process applicability; excluded flows; uncertainty and data gaps
update_trigger	Card architecture, primary chip/package, PCB stack-up, memory, cooling, interface, firmware/test profile, supplier route, site, energy supply, yield, packaging, classification, reference identity or evidence basis changes materially

11. Data Sources

Source id	Type	Reference	Used for
un-cpc-3-2025	official_guidance	United Nations Statistics Division, CPC Version 3.0 Structure, 30 June 2025, official CSV: https://unstats.un.org/unsd/classifications/Econ/Download/In%20Text/CPC_Ver_3.0_Structure_30Jun2025.csv; official class detail: https://unstats.un.org/unsd/classifications/Econ/Detail/EN/1073/45281; retrieved 2026-08-09	Exact category identity, included expansion-card examples, and exclusion of hubs, routers and gateways
tiangong-flow-verification-2026	dataset	TianGong LCA CLI read-only verification on 2026-08-09: state-code 100 Product flow cc906112-5ebd-437c-b701-88faeeac2f81, exact CPC 3.0 45281; Mass 93a60a56-a3c8-11da-a746-0800200b9a66; Units of mass 93a60a57-a4c8-11da-a746-0800200c9a66; reference unit kg	Reference-product identity and unit chain; no non-reference inventory UUID inferred
itu-t-l1410-2024	standard	ITU-T Recommendation L.1410, Methodology for environmental life cycle assessments of information and communication technology goods, networks and services, 11/2024, https://handle.itu.int/11.1002/1000/16010; retrieved 2026-08-09	ICT-good functional-unit qualifiers, hierarchical electronic/mechanical/cooling/cable and PCBA component structure, upstream life-cycle coverage and cradle-to-gate reporting
eu-pef-2021-2279	official_guidance	European Commission Recommendation (EU) 2021/2279 on the use of Environmental Footprint methods, Annex I Product Environmental Footprint method, https://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX%3A32021H2279; retrieved 2026-08-09	Product-specific bill of materials, company-specific manufacturing data, functional/declaration unit, reference flow, allocation, completeness and data-quality controls
ipc-1752a-2018	standard	IPC-1752A, Materials Declaration Management, official IPC materials-declaration page, https://www.electronics.org/materials-declaration-data-exchange-standards-homepage; retrieved 2026-08-09	Supplier material declarations for bulk materials, components, printed boards, subassemblies and products
iec-62474-2018	standard	IEC 62474:2018, Material declaration for products of and for the electrotechnical industry, https://webstore.iec.ch/en/publication/29857; retrieved 2026-08-09	Supplier material-declaration structure and the limitation that composition declarations do not replace process-chemical or use-emission records
ipc-jstd001j-a610j-2024	standard	IPC, release notice for J-STD-001J and IPC-A-610J, https://www.electronics.org/news-release/ipc-releases-j-revisions-two-leading-standards-electronics-assembly; retrieved 2026-08-09	Soldering materials/process controls, printed-board assembly and post-assembly acceptance evidence
mass-balance-identity	method_factor	Physical mass-balance identity: measured inputs equal outputs, inventory change, wastes and measured releases within the same declared process boundary and period	Layer reconciliation, yield, stock balance, waste and validation calculations; no category-specific numeric factor